CARRIER MATERIAL FOR VINYL FLOOR COVERING
A carrier material for vinyl floor covering is provided where the carrier includes a nonwoven layer of fibers containing thermoplastic fibers and a scrim for eliminating wrinkles in the vinyl floor covering. The scrim includes weft threads configured to match the shrinkage in cross machine direction of the nonwoven layer of fibers including thermoplastic fibers for preventing the formation of printing errors and/or surface irregularities in the vinyl floor covering.
1 . A carrier for vinyl floor coverings comprising:
a nonwoven layer of fibers comprising thermoplastic fibers, and
a scrim comprising weft threads, wherein the shrinkage of the weft threads is configured to match the shrinkage in cross machine direction of the nonwoven layer of fibers comprising thermoplastic fibers.
2 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature in the range of 140° C. to 170° C. that differs at most by 1.00% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
3 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.01%.
4 . A method comprising: producing a roofing membrane comprising the carrier according to claim 1 .
5 . A method comprising: producing a roofing underlayment sheet comprising the carrier according to claim 1 .
6 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature in the range of 140° C. to 170° C. that differs at most by 0.50% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
7 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature in the range of 140° C. to 170° C. that differs at most by 0.25% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
8 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature in the range of 140° C. to 170° C. that differs at most by 0.10% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
9 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature of 150° C. that differs at most by 1.00% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
10 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature of 150° C. that differs at most by 0.50% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
11 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature of 150° C. that differs at most by 0.25% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
12 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim comprised in the carrier has a free shrinkage in weft direction at a temperature of 150° C. that differs at most by 0.10% from the free shrinkage in cross machine direction of the nonwoven layer of fibers comprised in the carrier at the same temperature to prevent buckling of the weft threads of the scrim.
13 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.15%.
14 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.20%.
15 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.25%.
16 . The carrier for vinyl floor coverings according to claim 1 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.30%.
17 . The carrier for vinyl floor coverings according to claim 2 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.10%.
18 . The carrier for vinyl floor coverings according to claim 2 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.20%.
19 . The carrier for vinyl floor coverings according to claim 2 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.25%.
20 . The carrier for vinyl floor coverings according to claim 2 , wherein the scrim has a free shrinkage, at a temperature of 150° C. and a residence time of 1 minute, of at least 0.30%.