METHOD FOR POSITIONALLY STABLE SOLDERING
A method for positionally stable soldering of at least one component part contact face ( 11 ) of an electronic component part ( 1 ) to at least one corresponding carrier plate contact face ( 12 ) of a carrier plate ( 2 ), said method having the following steps: a) mounting at least two adhesive points ( 3 a, 3 b, 8 a, 8 b, 9 a, 9 b ) on the carrier plate ( 2 ), wherein the position of each adhesive point ( 3 a, 3 b, 8 a, 8 b, 9 a, 9 b ) is predefined, b) fitting the printed carrier plate ( 2 ) with the at least one electronic component part ( 1 ), wherein the position of the adhesive points ( 3 a, 3 b, 8 a, 8 b, 9 a, 9 b ) is predefined in step a) in such a way that the at least one electronic component part ( 1 ) contacts the at least two adhesive points ( 3 a, 3 b, 8 a, 8 b, 9 a, 9 b ) substantially in an edge region formed by the at least one side face ( 5 a, 5 b, 5 c, 5 d ) and the lower face 6 and the at least one component part contact face ( 11 ) at least partially overlaps the at least one carrier plate contact face ( 12 ), c) waiting for completion of a curing process of the adhesive points ( 3 a, 3 b, 8 a, 8 b, 9 a, 9 b ) for a predefinable period of time t, d) heating the solder material ( 13 ) in order to establish an electrical, mechanical and/or thermal connection between the at least one component part contact face ( 11 ) and the at least one carrier plate contact face ( 12 ).
1 . A method for positionally stable soldering of at least one component part contact face ( 11 ) of an electronic component part ( 1 ) to at least one corresponding carrier plate contact face ( 12 ) of a carrier plate ( 2 ), wherein the at least one electronic component part ( 1 ) has a lower and upper face ( 6 and 4 ) and also at least one side face ( 5 a , 5 b , 5 c , 5 d ) connecting the lower face to the upper face ( 6 and 4 ), wherein the at least one component part contact face ( 11 ) is formed on the lower face ( 6 ) and the at least one carrier plate contact face ( 12 ) at least partly has solder material ( 13 ), wherein the electronic component part ( 1 ) is an optoelectronic component part, the method comprising:
a) mounting at least two adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) on the carrier plate ( 2 ), wherein the position of each adhesive point ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) is predefined;
b) fitting the carrier plate ( 2 ) with the at least one electronic component part ( 1 ), wherein the position of the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) is predefined in step a) in such a way that the at least one electronic component part ( 1 ) contacts the at least two adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) substantially in an edge region formed by the at least one side face ( 5 a , 5 b , 5 c , 5 d ) and the lower face 6 and the at least one component part contact face ( 11 ) at least partially overlaps the at least one carrier plate contact face ( 12 );
c) waiting for completion of a curing process of the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) for a predefinable period of time t; and
d) heating the solder material ( 13 ) in order to establish an electrical, mechanical and/or thermal connection between the at least one component part contact face ( 11 ) and the at least one carrier plate contact face ( 12 ).
2 . The method of claim 1 , wherein the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are arranged in such a way that a virtual straight line of connection between the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) forms a straight line through the centre point of the lower face ( 6 ) of the at least one electronic component part ( 1 ).
3 . The method of claim 1 , wherein the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are arranged in such a way that an adhesive point ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) is arranged at each corner ( 10 a , 10 b , 10 c , 10 d ) of the at least one electronic component part ( 1 ).
4 . The method of claim 1 , wherein a corresponding adhesive point ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) is provided at each corner ( 10 a , 10 b , 10 c , 10 d ) of the electronic component part ( 1 ).
5 . The method of claim 1 , wherein three adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are provided, of which the virtual straight lines of connection form an equilateral triangle, wherein the centroid of this equilateral triangle coincides with the centre point of the lower face ( 6 ).
6 . The method of claim 1 , wherein the at least two adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) consist of a heat-curing adhesive material, wherein the temperature necessary for the heat curing lies below the melting point of the solder material ( 13 ).
7 . The method of claim 1 , wherein the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are arranged in positions that are exposed in step c) to a heat curing and in so doing are exposed substantially to identical thermal conditions.
8 . The method of claim 1 , wherein the volume of the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) is predefinable in step a).
9 . The method of claim 1 , wherein a solder stop mask ( 14 ) applied to the carrier plate surface covers an edge region ( 15 ) of the at least one carrier plate contact face ( 12 ) and in step a) adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are mounted in this edge region ( 15 ) on the solder stop mask ( 14 ).
10 . The method of claim 1 , wherein a solder stop mask ( 14 ) applied to the carrier plate surface ends before an edge region ( 15 ) of the at least one carrier plate contact face ( 12 ) and in step a) adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are mounted in this edge region ( 15 ) on the solder stop mask ( 14 ).
11 . The method of claim 1 , wherein the at least one electronic component part ( 1 ) has at least two or three component part contact faces ( 11 ) and at least two or three corresponding carrier plate contact faces ( 12 ).
12 . The method of claim 1 , wherein the at least one electronic component part ( 1 ) is an LED.
13 . The method of claim 1 , wherein the at least one electronic component part ( 1 ) is a surface mounted device (SMD) component part.
14 . The method of claim 1 , wherein the ratio of the weight of the at least one electronic component part ( 1 ) to the electrically effective contact area is less than 50 mg/mm 2 .
15 . A carrier plate ( 2 ) comprising:
at least one electronic component part ( 1 ) having at least one component part contact face ( 11 );
at least one carrier plate contact face ( 12 ) corresponding to said component part contact face, wherein the at least one electronic component part ( 1 ) has a lower and upper face ( 6 and 4 ) and also at least one side face ( 5 a , 5 b , 5 c , 5 d ) connecting the lower face to the upper face ( 6 and 4 ), wherein the at least one component part contact face ( 11 ) is formed on the lower face ( 6 ) and the at least one carrier plate contact face ( 12 ) at least partly has solder material ( 13 ),
wherein the electronic component part ( 1 ) is an optoelectronic component part, characterised in that the carrier plate ( 2 ) has at least two adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ), wherein the position of each adhesive point ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) is predefinable, wherein the carrier plate ( 2 ) is fitted with the at least one electronic component part ( 1 ), wherein the position of the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) can be predefined in such a way that the at least one electronic component part ( 1 ) contacts the at least two adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) substantially in an edge region formed by the at least one side face ( 5 a , 5 b , 5 c , 5 d ) and the lower face ( 6 ) and the at least one component part contact face ( 11 ) partially overlaps the at least one carrier plate contact face ( 12 ), wherein the adhesive points ( 3 a , 3 b , 8 a , 8 b , 9 a , 9 b ) are configured to change from an uncured state receiving the electronic component part ( 1 ) into a cured state mechanically stabilising the electronic component part ( 1 ), wherein the at least one component part contact face ( 11 ) can be electrically, mechanically and/or thermally connected to the at least one carrier plate contact face ( 12 ) by heating the solder material ( 13 ).
16 . The method of claim 13 , wherein the SMD component part is one without protruding terminal pins and/or without protruding component part contact faces ( 11 ).
17 . The method of claim 14 , wherein the ratio of the weight of the at least one electronic component part ( 1 ) to the electrically effective contact area is less than 10 mg/mm 2 .