IP Library Granted Patent US 9,793,571
Granted Patent B2
US 9,793,571 · App. 14/913,548 · Granted Oct 17, 2017

Apparatus for bonding separators in electrical devices

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,793,571
App. No.
14/913,548
Granted
Oct 17, 2017
Kind
B2
Abstract

An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, includes a transmission unit configured to generate ultrasonic oscillations, an amplifier unit configured to amplify the generated oscillations, an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other, and separator conveyance units configured to convey the separators to a bonding position where the abutting part bonds the pair of separators to each other, the transmission unit, the amplifier unit, and the abutting part are laid out parallel to a direction in which the separators are conveyed.

Claims (78)

1. An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, comprising:

a transmission unit configured to generate ultrasonic oscillations;

an amplifier unit configured to amplify the generated oscillations;

an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other; and

separator conveyance units configured to convey the separators to a bonding position where the abutting part bonds the pair of separators to each other,

the transmission unit, the amplifier unit, and the abutting part are laid out parallel to a direction in which the separators are conveyed.

2. The apparatus for bonding separators in electrical devices according to claim 1 , wherein

the abutting part comprises multiple contact portions configured to contact the separators, and

is configured to rotate around a rotational axis that is parallel to the direction in which the abutting part and the transmission unit are arranged.

3. The apparatus for bonding separators in electrical devices according to claim 1 , further comprising

a holding unit configured to hold the abutting part,

the abutting part being disposed closer to a position in which the separators are superposed than the holding unit in the direction in which the separators are conveyed.

4. The apparatus for bonding separators in electrical devices according to claim 1 , wherein

the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and

the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed.

5. The apparatus for bonding separators in electrical devices according to claim 4 , wherein

the contact portion is one of multiple contact portions disposed on the main body portion, and

the multiple contact portions are configured to be replaceable.

6. The apparatus for bonding separators in electrical devices according to claim 5 , wherein

the main body portion is configured to be rotatable, and

the contact portion is configured to be replaced by rotating the main body portion.

7. The apparatus for bonding separators in electrical devices according to claim 6 , further comprising:

a holding unit configured to hold the abutting part,

the holding unit comprises an abutting member configured to protrude and retract with respect to the abutting part, and

the holding unit is configured to switch between rotating and fixing the main body portion by switching between contacting and not contacting the abutting member to abutting part.

8. The apparatus for bonding separators in electrical devices according to claim 1 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are the same.

9. The apparatus for bonding separators in electrical devices according to claim 1 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are different.

10. The apparatus for bonding separators in electrical devices according to claim 1 , wherein

the separator conveyance unit comprises a conveyance drum configured to convey separators, and

the abutting part is disposed further outward than the conveyance drum in a width direction of the separators to be conveyed.

11. The apparatus for bonding separators in electrical devices according to claim 2 , further comprising

a holding unit configured to hold the abutting part,

the abutting part being disposed closer to a position in which the separators are superposed than the holding unit in the direction in which the separators are conveyed.

12. The apparatus for bonding separators in electrical devices according to claim 10 , further comprising

a holding unit configured to hold the abutting part,

the abutting part being disposed closer to a position in which the separators are superposed than the holding unit in the direction in which the separators are conveyed.

13. The apparatus for bonding separators in electrical devices according to claim 2 , wherein

the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and

the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed.

14. The apparatus for bonding separators in electrical devices according to claim 3 , wherein

the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and

the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed.

15. The apparatus for bonding separators in electrical devices according to claim 10 , wherein

the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and

the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed.

16. The apparatus for bonding separators in electrical devices according to claim 2 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are different.

17. The apparatus for bonding separators in electrical devices according to claim 4 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are different.

18. The apparatus for bonding separators in electrical devices according to claim 3 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are different.

19. The apparatus for bonding separators in electrical devices according to claim 5 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are different.

20. The apparatus for bonding separators in electrical devices according to claim 6 , wherein

the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair,

the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws,

the first and second pairs are arranged on respective sides of the separators in a width direction, and

fastening directions of the screws of the first and second pairs are different.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2019
From: NISSAN MOTOR CO., LTD.
To: ENVISION AESC JAPAN LTD.
Reel/Frame 049888/0933 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2016
From: YANAGI, TAKAHIRO
To: NISSAN MOTOR CO., LTD.
Reel/Frame 037788/0442 →