Assembly of a semi-conductor lamp from separately produced components
View Patent ↗Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.
1. A semiconductor lamp having at least one semiconductor light source, comprising multiple separately produced components, wherein the components at least comprise:
an open driver housing;
a cover for the driver housing;
a first heat sink placed on the cover;
a substrate equipped with the at least one semiconductor light source;
a light-transmissive cover for the substrate;
a second heat sink, which at least laterally covers the driver housing; and
at least one terminal contact arranged on a rear of the driver housing;
wherein at least two of the components are connected to one another by means of joint extrusion coating.
2. The semiconductor lamp as claimed in claim 1 , wherein at least three of the components are connected to one another by means of the joint extrusion coating.
3. The semiconductor lamp as claimed in claim 1 , wherein the semiconductor lamp is a semiconductor lamp formed as at least one of dust-tight and water-tight by means of the joint extrusion coating.
4. The semiconductor lamp as claimed in claim 1 , wherein the semiconductor lamp further comprises a driver for operating the at least one semiconductor light source.
5. A method for producing a semiconductor lamp having at least one semiconductor light source, the method comprising:
inserting at least one open driver housing and a cover for the driver housing into an injection mold; and
extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material;
wherein, during the insertion, at least one of the following components is also inserted into the injection mold, so that this at least one component is also permanently connected to the other components inserted into the injection mold by the potting material:
a first heat sink placed on the cover;
a substrate equipped with the at least one semiconductor light source;
a light-transmissive cover for the substrate;
a second heat sink, which at least laterally covers the driver housing; and
at least one terminal contact arranged on a rear of the driver housing.
6. The method as claimed in claim 5 , wherein a pre-encapsulated driver is inserted into the driver housing before the extrusion coating.
7. The method as claimed in claim 6 , wherein at least one of the following is also pre-encapsulated with the driver:
the cover for the driver housing;
the first heat sink; and
the at least one terminal contact.
8. The semiconductor lamp as claimed in claim 4 , wherein the driver is a pre-encapsulated driver.
9. The semiconductor lamp as claimed in claim 8 , wherein at least one of the following is also pre-encapsulated with the driver:
the cover for the driver housing;
the first heat sink; and
the at least one terminal contact.