Organic optoelectronic component
View Patent ↗The invention relates to an organic optoelectronic component comprising a substrate ( 101 ) on which a first electrode ( 102 ), then an organic functional layer stack ( 103 ) having at least one organic optoelectronic layer, and then a second electrode ( 104 ) are successively arranged. A thin film encapsulation ( 107 ) is arranged over the second electrode ( 104 ) and in addition to the second electrode ( 104 ), at least one first intermediate layer ( 121 ) having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack ( 103 ) and the thin-film encapsulation ( 107 ).
1. An organic optoelectronic component, comprising:
a substrate, on which a first electrode, thereabove an organic functional layer stack having at least one organic optoelectronic layer, and thereabove a second electrode are arranged;
above the second electrode a thin-film encapsulation; and
between the organic functional layer stack and the thin-film encapsulation in addition to the second electrode at least one first intermediate layer having a different hardness than a directly adjacent layer,
wherein the thin-film encapsulation comprises one or more thin layers applied by at least one of chemical vapor deposition, atomic layer deposition or molecular layer deposition, and
wherein the thin-film encapsulation is configured to form a barrier with respect to at least one of moisture, oxygen or corrosive gas,
wherein the at least one first intermediate layer is arranged between the second electrode and the thin-film encapsulation,
wherein the at least one first intermediate layer directly adjoins the second electrode and has a greater hardness than the second electrode, and
wherein the at least one first intermediate layer has a lower hardness than a layer of the thin-film encapsulation that directly adjoins the at least one first intermediate layer.
2. The organic optoelectronic component according to claim 1 , wherein the at least one first intermediate layer is constructed to protect the organic functional layer stack against damage as a result of dirt particles, in particular dirt particles situated between the second electrode and the thin-film encapsulation.
3. The organic optoelectronic component according to claim 1 , wherein the second electrode comprises Al, Ag, Mg or a combination thereof and the first intermediate layer comprises Cr, Wo, V, Os, Ru, Ir or a combination thereof.
4. The organic optoelectronic component according to claim 1 , wherein a second intermediate layer directly adjoining the first intermediate layer is arranged between the first intermediate layer and the thin-film encapsulation, and the first intermediate layer has a greater hardness than the second intermediate layer.
5. The organic optoelectronic component according to claim 1 , wherein the at least one first intermediate layer completely covers the second electrode.
6. An organic optoelectronic component comprising:
a substrate, on which a first electrode, thereabove an organic functional layer stack having at least one organic optoelectronic layer, and thereabove a second electrode are arranged;
above the second electrode a thin-film encapsulation; and
between the organic functional layer stack and the thin-film encapsulation in addition to the second electrode at least one first intermediate layer having a different hardness than a directly adjacent layer,
wherein the at least one first intermediate layer is arranged between the second electrode and the thin-film encapsulation,
wherein the at least one first intermediate layer directly adjoins the second electrode and has a greater hardness than the second electrode, and
wherein the first intermediate layer has a lower hardness than a layer of the thin-film encapsulation that directly adjoins the first intermediate layer.
7. An organic optoelectronic component comprising:
a substrate, on which a first electrode, thereabove an organic functional layer stack having at least one organic optoelectronic layer, and thereabove a second electrode are arranged;
above the second electrode a thin-film encapsulation; and
between the organic functional layer stack and the thin-film encapsulation in addition to the second electrode at least one first intermediate layer having a different hardness than a directly adjacent layer,
wherein the at least one first intermediate layer is arranged between the second electrode and the thin-film encapsulation,
wherein the at least one first intermediate layer directly adjoins the second electrode and has a greater hardness than the second electrode,
wherein the first intermediate layer has a lower hardness than a layer of the thin-film encapsulation that directly adjoins the first intermediate layer, and
wherein the second electrode comprises Al, Ag, Mg or a combination thereof and the first intermediate layer comprises Ni, Ti, V or a combination thereof.