Optoelectronic component, optoelectronic device and method of producing an optoelectronic device
View Patent ↗An optoelectronic component includes a housing including a base having an upper side and a lower side, and a cap, and a laser chip arranged between the upper side of the base and the cap, wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base, the laser chip includes a second electrical contact pad, and the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.
1. An optoelectronic component comprising:
a housing comprising a base having an upper side and a lower side, and a cap, and
a laser chip arranged between the upper side of the base and the cap,
wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base,
the laser chip includes a second electrical contact pad, and
the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.
2. The optoelectronic component as claimed in claim 1 , wherein an electrically conductive pin extends between the upper side and the lower side through the base,
the pin is electrically insulated from the remaining sections of the base, and
the pin electrically conductively connects to the first solder contact pad.
3. The optoelectronic component as claimed in claim 2 , wherein the laser chip includes a first electrical contact pad, and
the first electrical contact pad electrically conductively connects to the pin with the aid of a first bonding wire.
4. The optoelectronic component as claimed in claim 1 , wherein the second solder contact pad encloses the first solder contact pad in a ring shape.
5. The optoelectronic component as claimed in claim 1 , wherein a platform is formed on the upper side of the base, and
the laser chip is arranged on the platform.
6. The optoelectronic component as claimed in claim 1 , wherein the laser chip is arranged such that a radiation direction of the laser chip is oriented perpendicularly to the lower side of the base.
7. The optoelectronic component as claimed in claim 1 , wherein the base and/or the cap include(s) steel.
8. The optoelectronic component as claimed in claim 1 , wherein the cap includes a window.
9. The optoelectronic component as claimed in claim 1 , wherein the cap is welded to the base.
10. An optoelectronic device comprising:
a printed circuit board, and
the optoelectronic component as claimed in claim 1 ,
wherein the optoelectronic component is arranged on a surface of the printed circuit board.
11. The optoelectronic device as claimed in claim 10 , wherein the optoelectronic device includes a plurality of optoelectronic components comprising:
a housing comprising a base having an upper side and a lower side, and a cap, and
a laser chip arranged between the upper side of the base and the cap,
wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base,
the laser chip includes a second electrical contact pad,
the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire, and
the optoelectronic components are arranged in a series circuit.
12. A method of producing an optoelectronic device comprising:
providing a printed circuit board;
providing the optoelectronic component as claimed in claim 1 ; and
arranging the optoelectronic component on a surface of the printed circuit board.
13. The method as claimed in claim 12 , wherein the optoelectronic component is arranged on the surface of the printed circuit board by surface mounting.
14. The method as claimed in claim 13 , wherein the optoelectronic component is arranged on the surface of the printed circuit board by reflow soldering.