Method for producing a component

1. A method for producing an optoelectronic component, comprising:

forming a first electrode on a substrate;

arranging a first mask structure on or above the substrate, wherein the first mask structure comprises a first structuring region comprising an opening and/or a region prepared for forming an opening;

arranging a second mask structure on or above the first mask structure;

forming a second structuring region in the first mask structure and in the second mask structure in such a way that at least one part of the first structuring region in the first mask structure is formed outside the second structuring region in the first mask structure;

forming an organic functional layer structure above the first electrode and/or the substrate and in the second structuring region;

removing the second mask structure and, if the first structuring region has the region prepared for forming the opening, forming the opening in the prepared region;

forming a second electrode above the organic functional layer structure and/or above the substrate in the first structuring region, after removing the second mask structure or, respectively, after forming the opening in the prepared region; and

removing the first mask structure;

wherein the first and/or the second mask structure are applied as a coating in a liquid state above the substrate and are subsequently hardened and/or dried above the substrate.

2. The method as claimed in claim 1 ,

wherein the first and/or the second mask structure are/is removed mechanically.

3. The method as claimed in claim 1 ,

wherein the first structuring region and/or the second structuring region are/is formed in such a way that by the first structuring region and/or the second structuring region information is represented in the optically active region, preferably a pictogram, an ideogram and/or lettering; a look through hole, a window, a see through opening.

4. The method as claimed in claim 1 ,

wherein forming the first structuring region and/or the second structuring region comprises forming at least one of the following structurings in the first mask structure and/or the second mask structure: a hole, a predetermined separating location, a ring structure.

5. The method as claimed in claim 1 ,

wherein the first structuring region is formed in such a way that it has a lower adhesion with regard to the substrate, a higher adhesion with regard to the second mask structure and/or a different cohesion than the first mask structure outside the first structuring region.

6. The method as claimed in claim 1 ,

wherein the second structuring region is formed in such a way that the second structuring region has a different adhesion with regard to the first mask structure, a different adhesion with regard to a further mask structure on the second mask structure and/or a different cohesion than the second mask structure outside the second structuring region.

7. The method as claimed in claim 1 ,

wherein the first mask structure and/or the second mask structure comprise(s) a lug, wherein the lug is formed in such a way that the first mask structure and/or the second mask structure are/is removable by a tensile force on the lug.

8. The method as claimed in claim 1 , furthermore comprising:

arranging a third mask structure, wherein the third mask structure is applied on or above the first mask structure after the second mask structure has been at least partly removed, and/or wherein the third mask structure is applied on or above the second mask structure.

9. The method as claimed in claim 1 ,

wherein the second mask structure comprises a structuring region and/or a prepared region before the process of arranging on or above the first mask structure.

10. The method as claimed in claim 9 ,

wherein the structuring region and/or the prepared region, after the process of arranging the second mask structure, is formed as second structuring region, as structure region of the second structuring region or as third structuring region.