Apparatuses, Systems and Methods for Providing Thermocycler Thermal Uniformity
A thermal block assembly including a sample block and two or more thermoelectric devices, is disclosed. The sample block has a top surface configured to receive a plurality of reaction vessels and an opposing bottom surface. The thermoelectric devices are operably coupled to the sample block, wherein each thermoelectric device includes a housing for a thermal sensor and a thermal control interface with a controller. Each thermoelectric device is further configured to operate independently from each other to provide a substantially uniform temperature profile throughout the sample block.
1 . A thermal block assembly, comprising:
a sample block with a top surface configured to receive a plurality of reaction vessels and an opposing bottom surface; and
two or more thermoelectric devices operably coupled to the sample block, wherein each thermoelectric device includes a housing for a thermal sensor and a thermal control interface in communications with a controller, wherein each thermoelectric device is a configured to operate independently from each other to provide a substantially uniform temperature profile throughout the sample block.
2 . The thermal block assembly of claim 1 , wherein each of the thermoelectric devices further comprise a top surface in thermal contact with the bottom surface of the sample block and an opposing bottom surface facing away from the sample block.
3 . The thermal block assembly of claim 2 , wherein the housing is a groove carved out of an edge surface of each thermoelectric device.
4 . The thermal block assembly of claim 3 , wherein the top surface comprises the groove.
5 . The thermal block assembly of claim 3 , wherein the bottom surface comprises the groove.
6 . The thermal block assembly of claim 1 , wherein the thermal sensor is selected from the group consisting of thermocouples, thermistors, platinum resistance thermometers and silicon bandgap temperature sensors.
7 . The thermal block assembly of claim 1 , wherein the thermal sensor is operably connected to the sample block.
8 . The thermal block assembly of claim 1 , wherein the controller is configured to provide two or more control channels.
9 . The thermal block assembly of claim 8 , wherein each control channel is associated with one of the thermoelectric devices on the thermal block assembly.
10 . The thermal block assembly of claim 9 , wherein each control channel is capable of controlling one of the thermoelectric devices and communicating with the thermal sensor associated with the thermoelectric device.
11 . The thermal block assembly of claim 1 , wherein the controller comprises two or more independent controllers.
12 . The thermal block assembly of claim 11 , wherein each independent controller comprises a computer processor.
13 . The thermal block assembly of claim 12 , wherein the computer processor is configured to control one of the two or more thermoelectric devices and to communicate with the thermal sensor associated with the thermoelectric device.
14 . The thermal block assembly of claim 1 , wherein the controller comprises two or more sub-controller elements.
15 . The thermal block assembly of claim 14 , wherein each of the two or more sub-controllers are operably connected to one of the thermoelectric devices.
16 . The thermal block assembly of claim 1 , further comprising a heat sink, wherein the heat sink comprises a baseplate and fins, wherein the baseplate comprises a top surface and an opposing bottom surface, wherein the top surface is in thermal contact with the opposing bottom surface of the thermoelectric devices, and the fins are pendant the opposing second surface.
17 . A thermoelectric device, comprising:
a first thermal conducting layer;
a second thermal conducting layer;
a plurality of Peltier elements comprised of semiconductor material sandwiched in between the first and the second thermal conducting layers; and
a thermal sensor housed in between the first and the second thermal conducting layers.
18 . The thermoelectric device of claim 17 , wherein the semiconductor material includes bismuth telluride.
19 . The thermoelectric device of claim 17 , wherein the first thermal conducting layer and the second thermal conducting layer comprise alumina.
20 . A thermoelectric device, comprising:
a first thermal conducting layer with an inner surface and an outer surface;
a second thermal conducting layer with an inner surface and an outer surface;
a plurality of Peltier elements comprised of semiconductor material that are adjacent to the inner surface of the first thermal conducting layer and the inner surface of the second thermal conducting layer; and
an open channel carved out of the first thermal conducting layer and the plurality of Peltier elements exposing the inner surface of the second thermal conducting layer, wherein the open channel is configured to contain a thermal sensor.
21 - 45 . (canceled)