WIRING BOARD
The wiring board of the present invention includes an insulating layer, a strip-shaped wiring conductor for signals disposed on a main surface of the insulating layer, and a plain conductor for grounding or power disposed on the main surface of the insulating layer; and the thickness of the plane conductor is larger than the thickness of the strip-shaped wiring conductor. In the wiring board of the present invention, the thickness of the plane conductor is preferably 1 to 15 μm larger than the thickness of the strip-shaped wiring conductor. The strip-shaped wiring conductor has a thickness of preferably 3 to 10 μm, and the plane conductor has a thickness of preferably 5 to 15 μm.
1 . A wiring board comprising:
an insulating layer;
a strip-shaped wiring conductor for a signal disposed on a main surface of the insulating layer; and
a plane conductor for grounding or power disposed on the main surface of the insulating layer, wherein the thickness of the plane conductor is larger than the thickness of the strip-shaped wiring conductor.
2 . The wiring board according to claim 1 , wherein the thickness of the plane conductor is 1 to 15 μm larger than the thickness of the strip-shaped wiring conductor.
3 . The wiring board according to claim 1 , wherein the strip-shaped wiring conductor has a thickness of 3 to 10 μm.
4 . The wiring board according to claim 1 , wherein the plane conductor has a thickness of 5 to 15 μm.