Epoxy resin with enhanced viscosity stability and use thereof
View Patent ↗The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).
1. A manufacturing method comprising applying an epoxy adhesive between two components; bonding the two components by partially curing the epoxy adhesive in a first curing stage to obtain a partially cured article; aging the partially cured article; and curing the partially cured article in a second curing stage, wherein the epoxy adhesive comprises:
a) 10 to 50 wt % of a toughener composition wherein the toughener is a reaction product produced by mixing polytetrahydrofuran, bisphenol A, trimethylolpropane, heating the resulting mixture to dissolve the bisphenol A, cooling the mixture and adding a diisocyanate and then adding an organometallic catalyst and polymerizing, wherein the amount of the bisphenol A is greater than 10% and less than 15 wt % based on the combined weight of the polytetrahydrofuran, bisphenol A, trimethylolpropane, diisocyanate and organometallic catalyst;
b) an epoxy resin;
c) a rubber comprising an epoxy resin modified carboxyl terminated butadiene/acrylonitrile copolymer;
d) a curing agent comprising a dicyandiamide; and
e) an accelerator comprising a tertiary amine.
2. The manufacturing method of claim 1 wherein the epoxy adhesive comprises 20-30 wt % of the toughener composition based on total weight of the epoxy adhesive.
3. The manufacturing method of claim 1 , wherein the epoxy adhesive further comprises at least one of a filler, a thixotropic agent, a viscosity regulator, an adhesion promoter, a surfactant, a wetting agent, a flexibilized epoxy agent, a gelling compound, a flame retardant, a pigment.