Fin-FET semiconductor device with a source/drain contact having varying different widths
A semiconductor device includes an active fin formed to extend in a first direction, a gate formed on the active fin and extending in a second direction crossing the first direction, a source/drain formed on upper portions of the active fin and disposed at one side of the gate, an interlayer insulation layer covering the gate and the source/drain, a source/drain contact passing through the interlayer insulation layer to be connected to the source/drain and including a first contact region and a second contact region positioned between the source/drain and the first contact region, and a spacer layer formed between the first contact region and the interlayer insulation layer. A width of the second contact region in the first direction is greater than the sum of a width of the first contact region in the first direction and a width of the spacer layer in the first direction.
1. A semiconductor device comprising:
an active fin formed to extend in a first direction;
a gate formed on the active fin and extending in a second direction crossing the first direction;
a source/drain formed on upper portions of the active fin and disposed at one side of the gate;
an interlayer insulation layer covering the gate and the source/drain;
a source/drain contact passing through the interlayer insulation layer to be connected to the source/drain and including a first contact region and a second contact region positioned between the source/drain and the first contact region; and
a spacer layer formed between the first contact region and the interlayer insulation layer,
wherein a width of the second contact region of the source/drain contact in the first direction is greater than the sum of a width of the first contact region of the source/drain contact in the first direction and a width of the spacer layer in the first direction,
wherein the spacer layer includes an insulation layer, and contacts the first contact region and the interlayer insulation layer,
wherein the interlayer insulation layer includes a first part and a second part formed under the first part, and
wherein on the basis of a particular line perpendicular to a bottom surface of the interlayer insulation layer, a width of the first part in the first direction from the particular line to a first surface of the spacer layer is greater than a width of the second part in the first direction from the particular line to a first surface of the second contact region.
2. The semiconductor device of claim 1 , wherein a bottom surface of the second contact region fully overlaps a bottom surface of the spacer layer.
3. The semiconductor device of claim 1 , wherein the spacer layer includes first and second spacer layers extending along a first sidewall of the first contact region, and
wherein the first spacer layer is formed between the first contact region and the second spacer layer.
4. The semiconductor device of claim 3 , wherein the spacer layer further includes third and fourth spacer layers extending along a second sidewall opposite to the first sidewall of the first contact region, and
wherein the third spacer layer is formed between the first contact region and the fourth spacer layer.
5. The semiconductor device of claim 3 , wherein the first spacer layer includes SiN.
6. The semiconductor device of claim 1 , wherein a top of the second part is positioned on the same plane with a top surface of the second contact region.
7. The semiconductor device of claim 1 , further comprising:
an etch stop layer formed on a top surface of the source/drain,
wherein the second contact region is formed in an opening of the etch stop layer.
8. The semiconductor device of claim 1 , wherein the second contact region includes a silicide layer.
9. The semiconductor device of claim 1 , wherein the spacer layer includes a first spacer layer extending along a first sidewall of the first contact region and a second spacer layer extending along a second sidewall opposite to the first sidewall of the first contact region,
wherein the first spacer layer includes a first surface contacting the first contact region and a second surface contacting the interlayer insulation layer, and
wherein the second spacer layer includes a first surface contacting the first contact region and a second surface contacting the interlayer insulation layer.
10. The semiconductor device of claim 1 , wherein the second part is adjacent to a top portion of the source/drain and is positioned between the gate and the source/drain contact.
11. A semiconductor device comprising:
an active fin formed to extend in a first direction;
a gate formed on the active fin and extending in a second direction crossing the first direction;
a source/drain formed on upper portions of the active fin and disposed at one side of the gate;
an interlayer insulation layer covering the gate and the source/drain;
a source/drain contact passing through the interlayer insulation layer to be connected to the source/drain and including a first contact region and a second contact region positioned between the source/drain and the first contact region; and
a spacer layer formed between the first contact region and the interlayer insulation layer,
wherein a width of the second contact region of the source/drain contact in the first direction is greater than the sum of a width of the first contact region of the source/drain contact in the first direction and a width of the spacer layer in the first direction,
wherein the spacer layer includes an insulation layer, and contacts the first contact region and the interlayer insulation layer,
wherein the spacer layer includes a first spacer layer extending along a first sidewall of the first contact region and a second spacer layer extending along a second sidewall opposite to the first sidewall of the first contact region,
wherein the first spacer layer includes a first surface contacting the first contact region and a second surface contacting the interlayer insulation layer,
wherein the second spacer layer includes a first surface contacting the first contact region and a second surface contacting the interlayer insulation layer,
wherein the second contact region includes a first surface and a second surface opposite to the first surface of the second contact region in the first direction,
wherein a distance from the first sidewall of the first contact region to the first surface of the second contact region in the first direction is greater than a distance from the first sidewall of the first contact region to the second surface of the first spacer layer in the first direction, and
wherein a distance from the second sidewall of the first contact region to the second surface of the second contact region in the first direction is greater than a distance from the second sidewall of the first contact region to the second surface of the second spacer layer in the first direction.
12. The semiconductor device of claim 11 , wherein the second contact region includes a silicide layer.
13. The semiconductor device of claim 11 , wherein a bottom surface of the second contact region fully overlaps a bottom surface of the spacer layer.
14. The semiconductor device of claim 11 , further comprising:
an etch stop layer formed on a top surface of the source/drain,
wherein the second contact region is formed in an opening of the etch stop layer.
15. A semiconductor device comprising:
an active fin formed to extend in a first direction;
a gate formed on the active fin and extending in a second direction crossing the first direction;
a source/drain formed on upper portions of the active fin and disposed at one side of the gate;
an interlayer insulation layer covering the gate and the source/drain;
a source/drain contact passing through the interlayer insulation layer to be connected to the source/drain and including a first contact region and a second contact region positioned between the source/drain and the first contact region; and
a spacer layer formed between the first contact region and the interlayer insulation layer,
wherein a width of the second contact region of the source/drain contact in the first direction is greater than the sum of a width of the first contact region of the source/drain contact in the first direction and a width of the spacer layer in the first direction,
wherein the spacer layer includes an insulation layer, and contacts the first contact region and the interlayer insulation layer,
wherein the spacer layer includes first and second spacer layers extending along a first sidewall of the first contact region,
wherein the first spacer layer is formed between the first contact region and the second spacer layer,
wherein the spacer layer further includes third and fourth spacer layers extending along a second sidewall opposite to the first sidewall of the first contact region,
wherein the third spacer layer is formed between the first contact region and the fourth spacer layer,
wherein the second contact region includes a first surface and a second surface opposite to the first surface of the second contact region in the first direction,
wherein a distance from the first sidewall of the first contact region to the first surface of the second contact region in the first direction is greater than a distance from the first sidewall of the first contact region to a first surface of the second spacer layer contacting the interlayer insulation layer in the first direction, and
wherein a distance from the second sidewall of the first contact region to the second surface of the second contact region in the first direction is greater than a distance from the second sidewall of the first contact region to a first surface of the fourth spacer layer contacting the interlayer insulation layer in the first direction.
16. The semiconductor device of claim 15 , wherein the second contact region includes a silicide layer.
17. The semiconductor device of claim 15 , wherein a bottom surface of the second contact region fully overlaps a bottom surface of the spacer layer.
18. The semiconductor device of claim 15 , further comprising:
an etch stop layer formed on a top surface of the source/drain,
wherein the second contact region is formed in an opening of the etch stop layer.