Rapid response sensor housing
A sensor assembly is provided that includes a housing having a unitary body with a proximal end portion and a distal end portion. The distal end portion is open and defines an internal cavity exposed to an outside environment, and the proximal end portion defines a plurality of internal passageways that extend and open into the internal cavity. A thin film resistive temperature device (RTD), or other micro-sensor, is disposed within the internal cavity, the thin film RTD having a plurality of lead wires that extend through the plurality of internal passageways, and the thin film RTD being in contact with at least one wall of the internal cavity. The thin film RTD and the lead wires are secured within the housing by a thermal adhesive having a matched coefficient of thermal expansion with that of the housing and the thin film RTD substrate.
1. A sensor assembly comprising:
a housing comprising a one-piece member having a proximal end portion and a distal end portion, the distal end portion being open and defining an internal cavity exposed to an outside environment, the proximal end portion defining a plurality of internal passageways separated by an intermediate wall of the one-piece member, the plurality of internal passageways extending and opening into the internal cavity;
a thin film resistive temperature device (RTD) disposed within the internal cavity and exposed to the outside environment, the thin film RTD having a pair of lead wires that extend from the thin film RTD through at least a subset of the plurality of internal passageways; and
an internal wall separating the internal cavity from the internal passageways, wherein the thin film RTD abuts the internal wall.
2. The sensor assembly according to claim 1 , wherein the internal cavity defines at least one surface that geometrically matches a contact surface of the thin film RTD.
3. The sensor assembly according to claim 2 , wherein the at least one surface of the internal cavity and the contact surface of the thin film RTD are flat.
4. The sensor assembly according to claim 1 , wherein the thin film RTD is secured within the internal cavity by a thermal adhesive.
5. The sensor assembly according to claim 4 , wherein the housing, the thermal adhesive, and a substrate of the thin-film RTD have a matched coefficient of thermal expansion.
6. The sensor assembly according to claim 5 , wherein the thermal adhesive is alumina based, and the housing is alumina.
7. The sensor assembly according to claim 1 , wherein the lead wires are secured within the internal passageways by a thermal adhesive.
8. The sensor assembly according to claim 1 , wherein the internal cavity and the internal passageways define a cylindrical geometry.
9. The sensor assembly according to claim 1 , wherein the internal cavity and the internal passageways define a rectangular geometry.
10. The sensor assembly according to claim 9 , wherein the internal cavity defines two lateral opposed walls that extend proximally to further define outer walls of the internal passageways.
11. The sensor assembly according to claim 1 , wherein the internal cavity defines a geometry that matches an outer geometric periphery of the thin film RTD.
12. A sensor assembly comprising:
a housing comprising a unitary body having a proximal end portion and a distal end portion, the distal end portion being open and defining an internal cavity exposed to an outside environment, the proximal end portion defining a plurality of internal passageways that extend and open into the internal cavity, the plurality of internal passageways being separated by intermediate walls; and
a thin film resistive temperature device (RTD) disposed within the internal cavity, the thin film RTD having a plurality of lead wires that extend from the thin film RTD through the plurality of internal passageways, and the thin film RTD being in contact with at least one wall of the internal cavity,
wherein the thin film RTD and the lead wires are secured within the housing by a thermal adhesive having a matched coefficient of thermal expansion with that of the housing and the thin film RTD.
13. The sensor assembly according to claim 12 , wherein the thin film RTD is one of a 2-wire, a 3-wire, or a 4-wire RTD.
14. A housing for use in positioning a thin film resistive temperature device (RTD) comprising a one-piece member having:
a proximal end portion and a distal end portion, the distal end portion being open and defining an internal cavity exposed to an outside environment, and the proximal end portion defining a plurality of internal passageways separated by an intermediate wall of the one-piece member, the plurality of internal passageways extending and opening into the internal cavity, the internal cavity defining at least one surface that geometrically matches a contact surface of the thin film RTD; and
an internal wall separating the internal cavity from the internal passageways, wherein the thin film RTD abuts the internal wall for proper positioning within the housing.
15. A housing for use in positioning a micro-sensor comprising a one-piece member having:
a proximal end portion and a distal end portion, the distal end portion being open and defining an internal cavity exposed to an outside environment, the proximal end portion defining a plurality of internal passageways separated by an intermediate wall of the one-piece member, the plurality of internal passageways extending and opening into the internal cavity, the internal cavity defining at least one surface that geometrically matches a contact surface of the micro-sensor; and
an internal wall separating the internal cavity from the internal passageways, wherein the micro-sensor abuts the internal wall for proper positioning within the housing.