IP Library Granted Patent US 10,066,297
Granted Patent B2
US 10,066,297 · App. 14/924,488 · Granted Sep 4, 2018

Tiled showerhead for a semiconductor chemical vapor deposition reactor

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Quick Facts
Patent No.
US 10,066,297
App. No.
14/924,488
Granted
Sep 4, 2018
Kind
B2
Abstract

A showerhead for a semiconductor processing reactor formed by an array of showerhead tiles. Each showerhead tile has a plurality of process gas apertures, which may be in a central area of the tile or may extend over the entire tile. Each showerhead tile can be dimensioned for processing a respective substrate or a plurality of substrates or the array can be dimensioned for processing a substrate. An exhaust region surrounds the process gas apertures. The exhaust region has at least one exhaust aperture, and may include an exhaust slot, a plurality of connected exhaust slots or a plurality of exhaust apertures. The exhaust region surrounds the array of showerhead tiles, or a respective portion of the exhaust region surrounds the plurality of process gas apertures in each showerhead tile or group of showerhead tiles. A gas curtain aperture may be between the exhaust region and the process gas apertures of one of the showerhead tiles or adjacent to the central area of the tile.

Claims (26)

1. A showerhead for a semiconductor-processing reactor, comprising:

an array of showerhead tiles, with each showerhead tile having a plurality of process gas apertures in a central area of the showerhead tile and a border, the border of each tile in contact with and connected to a border of at least one other tile, each showerhead tile of the array being dimensioned for processing a plurality of substrates; and

an exhaust region surrounding the process gas apertures and including a surface extending from one or more central areas of one or more of the showerhead tiles, the exhaust region having at least one exhaust aperture in the surface.

2. The showerhead of claim 1 wherein each showerhead tile of the array of showerhead tiles is dimensioned for processing 4, 6 or 9 substrates.

3. The showerhead of claim 1 wherein the exhaust region surrounds the array of showerhead tiles.

4. The showerhead of claim 1 wherein the exhaust region is a part of each showerhead tile and surrounds the process gas apertures of each showerhead tile.

5. The showerhead of claim 1 wherein the at least one exhaust aperture includes a plurality of exhaust apertures.

6. The showerhead of claim 1 further comprising a flange surrounding the exhaust region and having a surface extending from the exhaust region surface.

7. The showerhead of claim 1 wherein each showerhead tile is square, circular, rectangular or polygonal.

8. The showerhead of claim 1 wherein each showerhead tile has at least one gas curtain aperture between the exhaust region and the plurality of process gas apertures.

9. The showerhead of claim 1 wherein each showerhead tile includes at least one gas curtain aperture.

10. The showerhead of claim 1 wherein the array of showerhead tiles is a square array.

11. The showerhead of claim 1 wherein the array of showerhead tiles is a rectangular array.

12. The showerhead of claim 1 wherein the array of showerhead tiles has a rotational symmetry.

13. A showerhead for a semiconductor-processing reactor, comprising:

an array of showerhead tiles, each showerhead tile having a border and a plurality of process gas apertures in a central area of the showerhead tile with at least one fluid passageway adjacent to the central area of the showerhead tile, the border of each tile in contact with and connected to a border of at least one other tile, each showerhead tile of the array being dimensioned for processing a plurality of substrates; and

a plurality of exhaust regions, each exhaust region surrounding the central area of each showerhead tile, each exhaust region including a surface extending from the central area of each showerhead tile, and each exhaust region having at least one exhaust aperture in the surface.

14. The showerhead of claim 13 , wherein each showerhead tile of the array of showerhead tiles is dimensioned for processing 4, 6 or 9 substrates.

15. The showerhead of claim 13 wherein, on each showerhead tile, the at least one fluid passageway includes two cooling passageways.

16. The showerhead of claim 13 wherein, on each showerhead tile, the at least one fluid passageway includes two gas passageways fluidly connected to gas curtain apertures.

17. The showerhead of claim 13 wherein, on each showerhead tile, the at least one fluid passageway is between a portion of the central area and a portion of the exhaust region.

18. A showerhead for a semiconductor-processing reactor, comprising:

an array of showerhead tiles, each showerhead tile having a border, a plurality of process gas apertures in a central area of the showerhead tile and at least one fluid passageway adjacent to the central area of the showerhead tile, the border of each showerhead tile in contact with and connected to a border of at least one other showerhead tile; and

an exhaust region surrounding the array of showerhead tiles and including a surface extending from the central areas of the showerhead tiles, the exhaust region having at least one exhaust aperture in the surface.

19. The showerhead of claim 18 wherein each showerhead tile of the array of showerhead tiles is dimensioned for processing a plurality of substrates.

20. The showerhead of claim 18 further including a gas curtain region surrounding the array of showerhead tiles and having a plurality of gas curtain apertures, wherein the exhaust region surrounds the gas curtain region.

Assignments (5)
SECURITY INTEREST Recorded Aug 28, 2023
From: UTICA LEASECO, LLC
To: TIGER FINANCE, LLC
Reel/Frame 064731/0814 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 055766 FRAME: 0279. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 9, 2021
From: UTICA LEASECO, LLC SECURED PARTY
To: UTICA LEASECO, LLC ASSIGNEE
Reel/Frame 057117/0811 →
CONFIRMATION OF FORECLOSURE TRANSFER OF PATENT RIGHTS Recorded Feb 25, 2021
From: UTICA LEASECO, LLC SECURED PARTY
To: UTICA LEASECO, LLC ASSIGNEE
Reel/Frame 055766/0279 →
SECURITY INTEREST Recorded Apr 29, 2019
From: ALTA DEVICES, INC.
To: UTICA LEASECO, LLC
Reel/Frame 049027/0944 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2015
From: HIGASHI, GREGG; LERNER, ALEXANDER; SORABJI, KHURSHED; WASHINGTON, LORI D; HEGEDUS, ANDREAS
To: ALTA DEVICES, INC.
Reel/Frame 036896/0304 →