Face-down printing apparatus and method
View Patent ↗Film-forming apparatuses, systems, and methods are provided. The apparatus can include a substrate positioning system and a printing array that includes an inkjet printing array and/or a thermal printing array. The positioning system can be a gas-bearing plate system. The positioning system can be configured to move a substrate between a first position, away from the printing array, and a second position, above the printing array. The apparatuses, systems, and methods can be used to manufacture organic light emitting devices (OLEDs), for example, flat panel displays.
1. A film-forming apparatus comprising:
a gas-bearing system configured to support a substrate, wherein the gas bearing system comprises a first plurality of gas apertures and a second plurality of vacuum apertures formed in a top surface of the gas bearing;
a printing array set in the top surface of the gas-bearing system; said printing array set between the first and second plurality of apertures formed in the top surface of the gas bearing, wherein the printing array upwardly faces the substrate; and
a substrate positioning system configured to convey the substrate, wherein the substrate positioning system comprises a substrate holder mounted to a linear actuator system.
2. The film-forming apparatus of claim 1 , wherein the printing array comprises an inkjet printing array.
3. The film-forming apparatus of claim 2 , further comprising a film-forming material reservoir in fluid communication with the inkjet printing array.
4. The film-forming apparatus of claim 1 , wherein the gas bearing system is configured to provide a defined gap between the top surface of the gas bearing and the substrate.
5. The film-forming apparatus of claim 1 , wherein the holder is a vacuum chuck.
6. The film-forming apparatus of claim 1 ; said linear actuator system comprising a track and a trolley, wherein the substrate holder is mounted to the trolley.
7. The film-forming apparatus of claim 1 , further comprising a housing enclosing the film-forming apparatus, wherein the housing defines a process chamber.
8. The film-forming apparatus of claim 7 , further comprising an environmental control system configured to provide a controlled environment for the process chamber.
9. The film-forming apparatus of claim 8 , wherein the controlled environment comprises an inert gas environment.
10. The film-forming apparatus of claim 9 , wherein the inert gas environment is a nitrogen gas environment.
11. The film-forming apparatus of claim 9 , wherein the inert environment is substantially free of reactive gases.
12. The film-forming apparatus of claim 11 , wherein the reactive gases are maintained at less than 100 ppm.
13. The film-forming apparatus of claim 8 , wherein the controlled environment comprises maintaining the process chamber at a controlled pressure.
14. The film-forming apparatus of claim 13 , wherein the controlled pressure comprises atmospheric pressure.
15. The film-forming apparatus of claim 7 , further comprising at least one load-locked chamber in interruptible gas communication with the process chamber.