Circuit package with internal and external shielding

1. A module, comprising:

a circuit package, comprising:

a first electronic component on a substrate, the first electronic component comprising a first die substrate with first electronic circuitry that generates electromagnetic radiation internally within the circuit package;

a second electronic component on the substrate, the second electronic component comprising a second die substrate with second electronic circuitry;

an internal shield electrically connected to ground and covering only a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the internally generated electromagnetic radiation from the first electronic circuitry; and

a molded compound disposed over the substrate and the first and second electronic components; and

an external shield disposed on at least one outer surface of the circuit package and electrically connected to ground, the external shield being configured to protect the circuit package from external electromagnetic radiation and environmental stress.

2. The module of claim 1 , wherein the internal shield comprises a metal layer applied to the surface of the second die substrate facing away from the substrate and electrically connected to ground via at least one bond wire contacting a corresponding at least one ground pad on or in the substrate.

3. The module of claim 1 , wherein the internal shield comprises a metal layer applied to the surface of the second die substrate facing away from the substrate and electrically connected to ground via at least one bond wire contacting the external shield.

4. The module of claim 1 , wherein the molded compound defines a trench extending from the surface of the internal shield to a top surface of the molded compound, a portion of the external shield being disposed within the trench, and

wherein the internal shield comprises a metal layer applied to the surface of the second die substrate facing away from the substrate and electrically connected to ground via the portion of the external shield disposed within the trench and contacting the metal layer.

5. The module of claim 1 , wherein the molded compound defines a trench extending from the internal shield to a top surface of the molded compound, and

wherein the internal shield comprises a metal layer applied to the surface of the second die substrate facing away from the substrate and electrically connected to ground via a filler metal, the filler metal being disposed in at least a portion of the trench and contacting both the metal layer and a portion of the external shield disposed over the trench.

6. The module of claim 1 , wherein the second electronic component comprises a flipped chip, such that the second electronic circuitry is on a surface of the second die substrate facing toward the substrate.

7. The module of claim 1 , wherein the internal shield comprises one of copper (Cu), silver (Ag), gold (Au), or aluminum (Al).

8. The module of claim 1 , wherein the external shield comprises one of copper (Cu), silver (Ag), gold (Au), or aluminum (Al).

9. The module of claim 2 , wherein the circuit package further comprises at least one surface mount technology (SMT) component on the substrate, mounted adjacent the second electronic component, and

wherein the at least one bond wire of the internal shield extends from the metal layer applied to the surface of the second die substrate facing away from the substrate, over the at least one SMT component, to provide a wire curtain that enables the internal shield to further shield the at least one SMT component from the internally generated electromagnetic radiation from the first electronic circuitry.

10. A circuit package in a shielded module comprising an external shield disposed on at least one outer surface of the circuit package and electrically connected to ground, the circuit package comprising:

a substrate;

an electronic component assembled or formed on the substrate, the electronic component comprising a die substrate with electronic circuitry on a surface of the die substrate facing toward the substrate;

a internal shield electrically connected to ground, the internal shield being disposed on and covering only a surface of the die substrate facing away from the substrate; and

a molded compound disposed over the substrate and the electronic component,

wherein the external shield is configured to protect the circuit package from external electromagnetic radiation, and the internal shield is configured to protect the electronic circuitry from internal electromagnetic radiation generated within the circuit package by at least one other electronic component assembled or formed on the substrate.

11. The circuit package of claim 10 , wherein the internal shield comprises a metal film electrically connected to ground via at least one bond wire contacting a corresponding at least one ground pad on or in the substrate.

12. The circuit package of claim 10 , wherein the internal shield comprises a metal film electrically connected to ground via at least one bond wire contacting the external shield.

13. The circuit package of claim 10 , wherein the molded compound defines a trench extending from the surface of the internal shield to a top surface of the molded compound, a portion of the external shield being disposed within the trench, and

wherein the internal shield comprises a metal film electrically connected to ground via a trench contact formed by the portion of the external shield disposed within the trench.

14. The circuit package of claim 13 , wherein the trench is at least partially filled with a conductive material from which the external shield is formed.

15. The circuit package of claim 10 , further comprising:

at least one surface-mount technology (SMT) component on the substrate adjacent the electronic component,

wherein the internal shield comprises a base shield formed of a metal film covering the surface of the die substrate facing away from the substrate and electrically connected to ground via a plurality of bond wires contacting a corresponding plurality of ground pads on or in the substrate, and

wherein the plurality of bond wires extend over the at least one SMT component, creating a wire curtain for protecting the at least one SMT component from the internal electromagnetic radiation generated by the at least one other electronic component.

16. The circuit package of claim 15 , wherein the base shield extends to outer edges of the die substrate.

17. The circuit package of claim 16 , wherein the plurality of bond wires are connected to the base shield around at least a portion of a periphery of the base shield.

18. The module of claim 1 , wherein the internal shield covers more than 90 percent of the surface of the second die substrate facing away from the substrate.

19. The circuit package of claim 10 , wherein the internal shield covers more than 90 percent of the surface of the die substrate facing away from the substrate.

20. A module, comprising:

a circuit package, comprising:

an electronic component comprising a die substrate and electronic circuitry on a bottom surface of the die substrate, the bottom surface facing a substrate of the circuit package;

an internal shield electrically connected to ground and substantially covering only a top surface of the die substrate, the top surface being opposite the bottom surface of the die substrate, wherein the internal shield shields the electronic circuitry of the electronic component from internally generated electromagnetic radiation generated by at least one other electronic component within the circuit package; and

a molded compound disposed over the substrate, the electronic component, the internal shield, and the at least one other electronic component; and

an external shield disposed on at least one outer surface of the circuit package and electrically connected to ground, wherein the external shield shields the circuit package from externally generated electromagnetic radiation generated outside the module.