Phase-change materials from wax-based colloidal dispersions and their process of making
View Patent ↗This invention generally relates to phase-change materials (“PCM” or “PCM materials”) made from colloidally-protected wax-based microstructures. This invention also relates to such PCM materials configured in various physical forms. This invention further relates to a process of configuring such PCM materials for a variety of end-use applications in which dampening of temperature fluctuations by absorption and desorption of heat is desired. This invention further relates to preparing colloidally-protected wax-based microstructures in particulate form that function as PCM materials.
1. A phase change material (PCM) comprising colloidally-protected wax based (CPWB) microstructures, wherein said CPWB microstructure comprises:
(A) a wax core, and
(B) said wax core being colloidally protected by polymer chains chemically bonded and thereby tethered to said wax core;
wherein said wax core comprises a paraffin component and a non-paraffin component;
wherein said paraffin component comprises at least one linear alkane wax defined by the general formula C n H 2n+2 , where “n” ranges from 13-80;
wherein said non-paraffin component comprises at least one wax selected from the group consisting of animal-based wax, plant-based wax, mineral wax, synthetic wax, a wax containing organic acids and/or esters, anhydrides, an emulsifier containing a mixture of organic acids and/or esters, and combinations thereof;
wherein said polymer chains comprise at least one polymer selected from the group consisting of polyvinyl alcohol and copolymers, cellulose ethers, polyethylene oxide, polyethyleneimines, polyvinylpyrrolidone, and copolymers, polyethylene glycol, polyacrylamides and poly (N-isopropylamides), pullulan, sodium alginate, gelatin, starches, and combinations thereof; and
wherein said polymer chains do not form a shell-like physical casing.
2. The PCM as recited in claim 1 , wherein a temperature operating range of said PCM is defined by the melting point of said paraffin component comprising at least one linear alkane wax defined by the general formula C n H 2n+2 , wherein “n” ranges from 13-80, and wherein said temperature operating range is characterized by the melting point of said at least one linear alkane wax at the pressure of the system in which said PCM is being used.
3. The PCM as recited in claim 2 , wherein said temperature operating range of said PCM is from −6° C. to 140 C°.
4. A matrix structure comprising PCM as recited in claim 1 .
5. The matrix structure as recited in claim 4 , wherein said PCM is in an aqueous emulsion form or a powder form.
6. The matrix structure as recited in claim 5 , wherein the dry-solids weight percent of said PCM in said aqueous emulsion form, by weight of said matrix structure is in the range of from 10% to 50%; and wherein the solids weight content of the PCM in said dry powder form is in the range of from 1% to 50% by weight of said matrix structure.
7. The matrix structure as recited in claim 4 , wherein said matrix structure is a construction wallboard.
8. The matrix structure as recited in claim 4 , wherein said PCM is in fine particle form is coated on a paper or a plastic sheet.
9. A process for preparing a powder form of the PCM comprising CPWB microstructures of claim 1 , comprising the steps of
(D) providing at least one PCM in aqueous wax emulsion form;
(E) subjecting said PCM to at least one powder-making process; and
(F) optionally subjecting the resulting powder from step (B) to a size reduction process;
wherein said emulsion is optionally subjected to additional drying before, during, or after said at least one powder-making process;
wherein said at least one powder-making process is selected from the group consisting of freeze drying; lyophilization, vacuum drying; air drying; spray drying; atomization; evaporation; tray drying; flash drying; drum drying; fluid-bed drying; oven drying; belt drying; microwave drying; solar drying; linear combinations thereof; and parallel combinations thereof.
10. The powder form of the PCM comprising CPWB microstructures prepared by the process of claim 9 .
11. The powder form of the PCM comprising CPWB microstructures as recited in claim 10 , wherein said powder form of PCM comprises particles in the average particle size range of from about 1 to about 1000 micron.
12. The powder form of the PCM comprising CPWB microstructures as recited in claim 10 , wherein said powder form of PCM comprises particles such that about 10%, 50% and/or 90% of the particles by weight are less than the average particle size within the range of from 1 to 1000 micron.
13. The powder form of the PCM comprising CPWB microstructures as recited in claim 10 , wherein said powder comprises dried 1-5 mm chips.