IP Library Granted Patent US 9,936,317
Granted Patent B2
US 9,936,317 · App. 14/928,157 · Granted Apr 3, 2018

Audio crosstalk calibration switch

Inventors: Gregory A. Maher (Cape Elizabeth, ME); Tyler Daigle (Portland, ME)
Assignee: Fairchild Semiconductor Corporation
H04R29/001H04R5/04H04R2420/09
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Quick Facts
Patent No.
US 9,936,317
App. No.
14/928,157
Granted
Apr 3, 2018
Kind
B2
Abstract

Methods and apparatus for calibrating an audio system including headset coupled to an electronic device via an audio dongle. In an example, a circuit configured to couple a Universal Serial Bus (USB) audio dongle with an audio circuit of an electronic device can include a first impedance configured to couple with a first audio channel of the audio circuit, a second impedance coupled in series with the first impedance and configured to couple with a second audio channel of the audio circuit, a third impedance coupled to a ground sense channel and to a node common to the first impedance and the second impedance, and a controller configured to initiate a first signal on the first channel, to monitor crosstalk of the first signal on the second audio channel and to adjust a setting of the third impedance to reduce the crosstalk.

Claims (35)

1. A circuit configured to couple a Universal Serial Bus (USB) audio dongle with an audio circuit of an electronic device, the circuit comprising:

a first impedance configured to be coupled with a first audio channel of the audio circuit;

a second impedance coupled in series with the first impedance and configured to be coupled with a second audio channel of the audio circuit;

a third impedance coupled to a ground sense channel and to a node common to the first impedance and the second impedance, the ground sense channel configured to be coupled to the USB audio dongle; and

a controller configured to initiate a first signal on the first audio channel, to monitor crosstalk of the first signal on the second audio channel and to adjust a setting of the third impedance to reduce the crosstalk.

2. The circuit of claim 1 , including a first switch configured to couple the first audio channel with the first impedance in a first state of the first switch and to couple the first audio channel with the second impedance in a second state of the first switch.

3. The circuit of claim 2 , including a second switch configured to couple the second audio channel with the first impedance in a first state of the second switch and to couple the second audio channel with the second impedance in a second state of the second switch.

4. The circuit of claim 3 , including:

first and second ground sense channel terminals configured to be coupled to the USB audio dongle; and

a third switch configured to couple the third impedance with the ground sense channel received on the first ground sense channel terminal in a first state of the third switch and to couple the third impedance with the ground sense channel received on the second ground sense channel terminal in a second state of the third switch.

5. The circuit of claim 3 , wherein the controller, prior to initiating the first signal, is configured to place the first switch in the first state of the first switch and the second switch in the first state of the second switch.

6. The circuit of claim 3 , wherein the controller, prior to initiating the first signal, is configured to place the first switch in the second state of the first switch and the second switch in the second state of the second switch.

7. The circuit of claim 3 , wherein the controller after adjusting the setting of the third impedance to reduce the crosstalk a first time, is configured to change a state of both the first and second switches, to initiate a second signal on the first audio channel, to monitor second crosstalk of the first signal on the second audio channel and to adjust a setting of the third impedance a second time to reduce the second crosstalk.

8. The circuit of claim 7 , wherein the second signal is an inaudible signal.

9. The circuit of claim 1 , wherein the first signal is an inaudible signal.

10. A method for reducing crosstalk of a headset coupled to an electronic device via a Universal Serial Bus (USB) audio dongle, the method comprising:

applying a signal to a first audio channel of a scaled model of the headset, the scaled model having at least three impedances sharing a first node, the applying the signal including applying the signal to a first impedance of the at least three impedances and applying the signal to the headset via the USB audio dongle, the scaled model including a second audio channel having a second impedance of the at least three impedances;

receiving a ground reference signal at a third impedance of the at least three impedances via the USB audio dongle;

receiving crosstalk at the second audio channel of the scaled model; and

adjusting the third impedance of the at least three impedances via a controller until the crosstalk in the second audio channel is substantially eliminated.

11. The method of claim 10 , including buffering a signal at the first node to provide a level shifted ground for the electronic device, the signal at the first node being based on the ground reference signal.

12. The method of claim 10 , wherein applying a signal to the first audio channel includes coupling a signal generator to the first audio channel using a first switch.

13. The method or claim 10 , wherein the receiving crosstalk at the second audio channel includes coupling a comparator to the second audio channel.

14. The method of claim 10 , wherein adjusting the third impedance includes comparing the crosstalk to the ground reference signal to provide a first crosstalk comparison result and adjusting the third impedance using the first crosstalk comparison result.

15. A circuit configured to couple a Universal Serial Bus (USB) audio dongle with an audio circuit of an electronic device, wherein the USB audio dongle is configured to receive an audio connection of a headset, the circuit comprising:

a first impedance configured to be coupled with a first audio channel of the audio circuit;

a second impedance coupled in series with the first impedance and configured to be coupled with a second audio channel of the audio circuit;

a third impedance coupled to a ground sense channel and to a node common to the first impedance and the second impedance, wherein the node is directly coupled to the first impedance and to the second impedance; and

a controller configured to initiate a first signal on the first audio channel, to monitor crosstalk of the first signal on the second audio channel and to adjust a setting of the third impedance to reduce the crosstalk,

wherein a first ratio of the first impedance to the third impedance, after adjustment of the third impedance, is substantially equal to a second ratio, the second ratio including a ratio of a speaker impedance of the headset to a common conductor impedance of a combination of the headset and the USB audio dongle.

16. The circuit of claim 15 , wherein the controller includes a comparator configured to compare one of the first audio channel or the second audio channel with a reference signal and to provide an output indicative of an adjustment of the setting of the third impedance.

17. The circuit of claim 16 , a first switch to couple one of the first audio channel or the second audio channel with the comparator.

18. The circuit of claim 15 , a second switch configured to couple the first signal to the first audio channel.

19. The circuit of claim 15 , including a signal generator configured to generate the first signal.

20. The circuit of claim 15 , wherein the first signal is an inaudible signal.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 058871, FRAME 0799 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 040075, FRAME 0644 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →
SECURITY INTEREST Recorded Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
PATENT SECURITY AGREEMENT Recorded Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2016
From: MAHER, GREGORY A.; DAIGLE, TYLER
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 037900/0219 →
Continuity (2)
Provisional Application 62073591 · Oct 31, 2014
Related Publication 20160127828A1 · May 5, 2016