Method for fabricating intermediate member of electronic element and method for fabricating electronic element
View Patent ↗A method for fabricating an intermediate member of an electronic element, comprises: preparing a glass substrate as a support substrate having a first surface; forming a first inorganic film that contains silicon and has a second surface and a third surface opposite to the second surface, in such a manner that the first surface of the support substrate is in contact with the second surface of the first inorganic film; forming a first polyimide film containing fluorine on the third surface of the first inorganic film; and forming a second inorganic film containing silicon on the first polyimide film.
1. A method for fabricating an intermediate member of an electronic element, comprising:
preparing a glass substrate as a support substrate having a first surface;
forming a first inorganic film that contains silicon and has a second surface and a third surface opposite to the second surface, in such a manner that the first surface of the support substrate is in contact with the second surface of the first inorganic film;
forming a first polyimide film containing fluorine on the third surface of the first inorganic film; and
forming a second inorganic film containing silicon on the first polyimide film.
2. The method according to claim 1 , further comprising forming a second polyimide film on the second inorganic film.
3. The method according to claim 1 , wherein the first inorganic film contains at least one selected from the group consisting of silicon nitride, silicon oxynitride, silicon oxide, and silicon oxycarbide.
4. The method according to claim 1 , wherein the second inorganic film contains a material impermeable to oxygen.
5. The method according to claim 1 , wherein the second inorganic film contains at least one selected from the group consisting of silicon nitride, silicon oxynitride, silicon oxide, silicon oxycarbide, and metal.
6. The method according to claim 2 , wherein the second polyimide film contains a hygroscopic material.
7. A method for fabricating an electronic element, comprising:
preparing a glass substrate as a support substrate having a first surface;
forming a first inorganic film that contains silicon and has a second surface and a third surface opposite to the second surface, in such a manner that the first surface of the support substrate is in contact with the second surface of the first inorganic film;
forming a first polyimide film containing fluorine on the third surface of the first inorganic film;
forming a second inorganic film containing silicon on the first polyimide film;
forming a second polyimide film on the second inorganic film; and
forming a circuit element on the second polyimide film.
8. The method according to claim 7 , wherein the circuit element is a thin-film transistor.
9. The method according to claim 7 , further comprising separating the first inorganic film from the support substrate by irradiating the support substrate with a laser beam after forming the circuit element.
10. The method according to claim 7 , wherein the first inorganic film contains at least one selected from the group consisting of silicon nitride, silicon oxynitride, silicon oxide, and silicon oxycarbide.
11. The method according to claim 7 , wherein the second inorganic film contains a material impermeable to oxygen.
12. The method according to claim 7 , wherein the second inorganic film may contain at least one selected from the group consisting of silicon nitride, silicon oxynitride, silicon oxide, silicon oxycarbide, and metal.
13. The method according to claim 7 , wherein the second polyimide film contains a hygroscopic material.