Method for electrical coupling and electric coupling arrangement

1. A method for electrically coupling a pad and a front face of a pillar, comprising:

shaping the front face of the pillar, the front face having at least partially a convex surface;

applying a suspension to the front face of the pillar or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles suspended within the carrier fluid and electrically conducting nanoparticles suspended within the carrier fluid, wherein the suspension is applied as a droplet that adheres to the front face of the pillar or to the pad with surface tension;

arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad;

evaporating the carrier fluid thereby concurrently confining each of the microparticles and the nanoparticles, and thereby concurrently arranging the nanoparticles and the microparticles into percolation paths between the front face of the pillar and the pad; and

sintering the arranged nanoparticles for forming metallic bonds at least between one of the nanoparticles or between the nanoparticles and the front face of the pillar or the pad.

2. The method of claim 1 , wherein no additional pressure over ambient pressure is applied between the front face of the pillar and the pad during evaporating the carrier fluid and sintering the arranged nanoparticles.

3. The method of claim 1 , wherein the pad comprises a pad material, the pillar comprises a pillar material, the microparticles comprise a microparticle material, and the nanoparticles comprise a nanoparticle material, wherein the pad material, the pillar material, the nanoparticle material and the microparticle material include Copper.

4. The method of claim 1 , wherein the pad, the pillar, the microparticles, and the nanoparticles include a same material.

5. The method of claim 1 , wherein applying the suspension comprises dipping the front face of the pillar into a reservoir providing the suspension.

6. The method of claim 1 , wherein the suspension is a bi-modal Copper ink.

7. The method of claim 1 , wherein the microparticles have a microparticle size and the nanoparticles have a nanoparticle size, and a ratio between the microparticle size and the nanoparticle size is chosen such that during evaporating of the carrier liquid, the nanoparticles can enter void regions between percolated microparticles.

8. The method of claim 7 , wherein the microparticle size is at least ten times larger than the nanoparticle size.

9. The method of claim 1 , wherein a volume ratio between the nanoparticles and the microparticles is between ten and one hundred in the suspension.

10. The method of claim 1 , wherein shaping the front face of the pillar comprises forming a dome-shaped front surface.

11. The method of claim 1 , wherein sintering is performed at a temperature lower than a melting temperature of the nanoparticles and the microparticles.

12. The method of claim 1 , wherein sintering the nanoparticles comprises providing formic acid.

13. The method of claim 1 , further comprising:

providing a plurality of pads arranged as an array; and

providing a plurality of pillars arranged as an array, each pillar having a front face;

wherein the steps of shaping, arranging, applying, evaporating and sintering are contemporaneously performed for a plurality of pad-pillar pairs.