IP Library Granted Patent US 10,236,026
Granted Patent B1
US 10,236,026 · App. 14/935,337 · Granted Mar 19, 2019

Thermal barrier layers and seed layers for control of thermal and structural properties of HAMR media

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Quick Facts
Patent No.
US 10,236,026
App. No.
14/935,337
Filed
Nov 6, 2015
Granted
Mar 19, 2019
Kind
B1
Art Unit
2688
USPC
369/13.33
Abstract

Thermal barrier layers and seed layers for control of thermal and structural properties of heat assisted magnetic recording (HAMR) media are provided. One such HAMR medium includes a substrate, a heat sink layer on the substrate, a thermal barrier layer of SrTiO 3 on the heat sink layer, an underlayer of MgO on the thermal barrier layer, and a magnetic recording layer on the underlayer. Another such HAMR medium includes a substrate, a heat sink layer on the substrate, a thermal barrier layer of an ABO3-type oxide on the heat sink layer, and a magnetic recording layer on the thermal barrier layer.

Claims (69)

1. A medium for heat assisted magnetic recording, the medium comprising:

a substrate;

a heat sink layer on the substrate;

a thermal barrier layer directly on the heat sink layer, the thermal barrier layer comprising SrTiO 3 ;

an underlayer on the thermal barrier layer, the underlayer comprising MgO; and

a magnetic recording layer on the underlayer,

wherein the heat sink layer is configured to dissipate heat from the magnetic recording layer.

2. The medium of claim 1 , wherein the thermal barrier layer has a cubic structure with (200) texture.

3. The medium of claim 2 , wherein the heat sink layer has a cubic structure with (200) texture.

4. The medium of claim 3 , wherein a lattice mismatch between the heat sink layer and the thermal barrier layer is less than 8 percent.

5. The medium of claim 4 , wherein the heat sink layer comprises a Cr-based alloy.

6. The medium of claim 5 , wherein the heat sink layer comprises CrW and the magnetic recording layer comprises FePt with a segregant.

7. The medium of claim 2 , wherein the underlayer has a cubic structure with (200) texture.

8. The medium of claim 1 , wherein a first thickness of the thermal barrier layer is between about 3 nm and about 10 nm and a second thickness of the underlayer is between about 2 nm and about 11 nm.

9. The medium of claim 1 , wherein a first thickness of the thermal barrier layer is about 7 nm and a second thickness of the underlayer is about 3 nm.

10. The medium of claim 1 , wherein the thermal barrier layer is configured to:

facilitate a heat transfer from the magnetic recording layer to the heat sink layer; and

impede a heat transfer from the heat sink layer to the magnetic recording layer.

11. The medium of claim 1 , wherein the thermal barrier layer is deposited at a temperature greater than 450 degrees Celsius using a first radio frequency (RF) magnetron sputtering process and the underlayer is deposited at a temperature greater than 450 degrees Celsius using a second RF magnetron sputtering process.

12. The medium of claim 11 , wherein the thermal barrier layer is deposited using a static magnet.

13. A heat assisted magnetic recording system comprising:

the medium of claim 1 ;

a near-field transducer light source configured to direct light energy on to the medium; and

a magnetic transducer configured to write information to the medium.

14. A method for fabricating a medium for heat assisted magnetic recording, the method comprising:

providing a substrate;

providing a heat sink layer on the substrate;

providing a thermal barrier layer directly on the heat sink layer, the thermal barrier layer comprising SrTiO 3 ;

providing an underlayer on the thermal barrier layer, the underlayer comprising MgO; and

providing a magnetic recording layer on the underlayer,

wherein the heat sink layer is configured to dissipate heat from the magnetic recording layer.

15. The method of claim 14 , wherein providing the thermal barrier layer on the heat sink layer comprises:

depositing the thermal barrier layer on the heat sink layer at a temperature greater than 450 degrees Celsius using a first RF magnetron sputtering process.

16. The method of claim 15 , wherein providing the underlayer on the thermal barrier layer comprises:

depositing the underlayer at a temperature greater than 450 degrees Celsius using a second RF magnetron sputtering process.

17. The method of claim 16 , wherein providing the underlayer on the thermal barrier layer further comprises:

depositing the thermal barrier layer using a static magnet.

18. The method of claim 14 , wherein the thermal barrier layer, the underlayer and the heat sink layer each has a cubic structure with (200) texture.

19. The method of claim 14 , wherein a lattice mismatch between the heat sink layer and the thermal barrier layer is less than 8 percent.

20. The method of claim 19 , wherein the heat sink layer comprises a Cr-based alloy.

21. The method of claim 14 , wherein a first thickness of the thermal barrier layer is between 3 nm and 10 nm and a second thickness of the underlayer is between 2 nm and 11 nm.

22. A medium for heat assisted magnetic recording, the medium comprising:

a substrate;

a heat sink layer on the substrate;

a thermal barrier layer directly on the heat sink layer, the thermal barrier layer comprising an ABO3-type oxide; and

a magnetic recording layer on the thermal barrier layer,

wherein the heat sink layer is configured to dissipate heat from the magnetic recording layer.

23. The medium of claim 22 , wherein the thermal barrier layer has a cubic structure with (200) texture.

24. The medium of claim 23 , wherein the heat sink layer has a cubic structure with (200) texture.

25. The medium of claim 22 , wherein the magnetic recording layer comprises FePt with a segregant.

26. The medium of claim 22 , wherein a lattice mismatch between the thermal barrier layer and the magnetic recording layer is between about 3 percent and about 8 percent.

27. The medium of claim 22 , wherein the ABO3-type oxide is selected from the group consisting of BaTiO 3 , SrHfO 3 , SrZrO 3 , PbTiO 3 and BaZrO 3 .

28. The medium of claim 22 , wherein a thermal conductivity of the thermal barrier layer is less than 10 Watts per meter Kelvin.

29. The medium of claim 22 , wherein the thermal barrier layer is configured to:

facilitate a heat transfer from the magnetic recording layer to the heat sink layer; and

impede a heat transfer from the heat sink layer to the magnetic recording layer.

30. A heat assisted magnetic recording system comprising:

the medium of claim 22 ;

a near-field transducer light source configured to direct light energy on to the medium; and

a magnetic transducer configured to write information to the medium.

31. A method for fabricating a medium for heat assisted magnetic recording, the method comprising:

providing a substrate;

providing a heat sink layer on the substrate;

providing a thermal barrier layer directly on the heat sink layer, the thermal barrier layer comprising an ABO3-type oxide; and

providing a magnetic recording layer on the thermal barrier layer,

wherein the heat sink layer is configured to dissipate heat from the magnetic recording layer.

32. The method of claim 31 , wherein the thermal barrier layer and the heat sink layer each has a cubic structure with (200) texture.

33. The method of claim 31 , wherein the ABO3-type oxide is selected from the group consisting of BaTiO 3 , SrHfO 3 , SrZrO 3 , PbTiO 3 and BaZrO 3 .

34. The method of claim 31 , wherein a thermal conductivity of the thermal barrier layer is less than 10 Watts per meter Kelvin.

Assignments (3)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0383 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WD MEDIA, LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0410 →