IP Library Granted Patent US 10,173,390
Granted Patent B2
US 10,173,390 · App. 14/936,521 · Granted Jan 8, 2019

Fiber molded article

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Quick Facts
Patent No.
US 10,173,390
App. No.
14/936,521
Granted
Jan 8, 2019
Kind
B2
Abstract

According to one embodiment, a fiber molded article includes fiber impregnated with thermoplastic resin, a plane base portion molded from the fiber, and a wall portion molded from the fiber and extending to an outside of a surface of the base portion to form an outer edge of the base portion. The wall portion has a through-hole. An entire periphery of an inner peripheral surface of the through-hole is covered with a film. The film is formed by melting the thermoplastic resin soaked into the fiber on the inner peripheral surface.

Claims (27)

1. A fiber molded article comprising:

a plane base portion;

a wall portion forming an outer edge around the base portion; and

a through-hole provided in a part of the wall portion,

the base portion and the wall portion molded from fiber impregnated with thermoplastic resin,

an inner surface of the through-hole covered with a melted and re-solidified film of the thermoplastic resin which impregnates the fiber.

2. The fiber molded article of claim 1 , wherein

an opening area of the through-hole in the wall portion is reduced by a thickness of the film.

3. The fiber molded article of claim 1 , wherein

a diameter of an opening portion at one end of the through-hole in the wall portion is larger than a diameter of another portion of the through-hole.

4. An electronic device comprising a housing, the housing comprising:

a plane base portion;

a wall portion forming an outer edge around the base portion; and

a through-hole provided in a part of the wall portion,

the base portion and the wall portion molded from fiber impregnated with thermoplastic resin,

an inner surface of the through-hole covered with a melted and re-solidified film of the thermoplastic resin which impregnates into the fiber.

5. The electronic device of claim 4 , wherein

an opening area of the through-hole in the housing is reduced by a thickness of the film.

6. The electronic device of claim 4 , wherein

a diameter of an opening portion at one end of the through-hole in the housing is larger than a diameter of another portion of the through-hole.

7. A method for manufacturing a fiber molded article, the method comprising:

forming a plane base portion and a wall portion, the wall portion forming an outer edge around the base portion, the base portion and the wall portion molded from fiber impregnated with thermoplastic resin;

forming a through-hole in a part of the wall portion;

hot-pressing the fiber impregnated with the thermoplastic resin;

melting the thermoplastic resin on an inner surface of the through-hole;

forming a film covering the inner surface of the through-hole by the molten thermoplastic resin; and

re-solidifying the film.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA CLIENT SOLUTIONS CO., LTD.
Reel/Frame 048720/0635 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2015
From: HORII, YASUYUKI; ITO, KAZUO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 037001/0236 →