Electronic component and corresponding mounting method
View Patent ↗An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion. The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.
1. An electronic component comprising electrical contact pads for soldering onto a mounting board, the electrical contact pads arranged over a soldering area having a central portion and a peripheral portion surrounding the central portion, wherein the electrical contact pads comprise:
at least one first electrical contact pad at the central portion of the soldering area and at a center portion of the electronic component, and
at least one second electrical contact pad at the peripheral portion of the soldering area,
wherein the at least one second electrical contact pad is horseshoe-shaped and encircles at least in part the at least one first electrical contact pad; and
wherein a radial extension of the at least one first electrical contact pad at the central portion of the soldering area extends over the peripheral portion of the soldering area and a distal portion of the at least one second electrical contact pad overhangs or protrudes towards the radial extension of the at least one first electrical contact pad and faces inward with respect to the horseshoe-shape.
2. The electronic component of claim 1 , wherein said contact pads occupy at least 50%, of said first and second electrical soldering area.
3. The electronic component of claim 1 , wherein said at least one first electrical contact pad and said at least one second electrical contact pad are a cathode contact pad and an anode contact pad, respectively.
4. The electronic component of claim 1 , wherein the electronic component includes a solid state light radiation source.
5. The electronic component of claim 1 , wherein said first and second electrical contact pads occupy at least 70% of said soldering area.
6. The electronic component of claim 1 , wherein said first and second electrical contact pads occupy at least 90% of said soldering area.
7. The electronic component of claim 1 , wherein the electronic component includes a LED light radiation source.
8. The electronic component of claim 1 , wherein a width of the radial extension of the at least one first electrical contact pad at the peripheral portion is narrower than a width of the at least one first electrical contact pad located at the central portion.