Electronic component and method for producing the same
An aspect of the invention is an electronic component including a semiconductor substrate 11 that has an electrode pad 12 , a first resin layer 14 and a third resin layer 15 that are located above the semiconductor substrate, a second resin layer 16 that is formed such that at least portions of the second resin layer are located on the first resin layer and the third resin layer, a resin projection 17 that includes the first to third resin layers and is higher than the first resin layer, and a wiring layer 24 that is electrically connected to the electrode pad and lies above the resin projection.
1. An electronic component comprising:
a substrate that has an electrode;
a first resin layer that is located above the substrate;
a second resin layer, at least a portion of the second resin layer being located on top of the first resin layer such that a portion of the first resin layer is sandwiched between the portion of the second resin layer and the substrate;
a resin projection that includes the first and second resin layers and is higher than the first resin layer;
a conductive layer that is electrically connected to the electrode and lies above the resin projection; and
a third resin layer that is located above the substrate and next to the first resin layer,
wherein at least a portion of the second resin layer is located on the third resin layer, and
the resin projection includes the third resin layer and is higher than the third resin layer.
2. The electronic component according to claim 1 ,
wherein the first resin layer has a same width as that of the third resin layer.
3. The electronic component according to claim 1 ,
wherein a length from a side portion of the first resin layer to a side portion of the third resin layer located under the conductive layer is larger than a width of the second resin layer located under the conductive layer.
4. The electronic component according to claim 1 , further comprising:
an insulating layer that is located between the substrate and the first and third resin layers and is in contact with the first and third resin layers,
wherein a portion of the second resin layer that is located between the first resin layer and the third resin layer is in contact with the insulating layer.
5. The electronic component according to claim 1 ,
wherein a height of the second resin layer from a highest portion of the first resin layer is larger than a height of the first resin layer.
6. The electronic component according to claim 1 ,
wherein the substrate has a plurality of the electrodes,
a plurality of the conductive layers lie above the resin projection, and
the plurality of conductive layers are electrically connected to the plurality of electrodes, respectively.
7. The electronic component according to claim 1 ,
wherein the substrate is a semiconductor substrate.
8. The electronic component according to claim 1 ,
wherein the conductive layer on the resin projection is to be joined to an electrode of a mounting substrate.