Methods for producing a transparent conductive film for a touch panel
A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra 2 /Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.
1. A method for producing a transparent conductive for a touch panel film comprising:
a step of forming a metal wiring portion on a support; and
a calender step of pressing a metal member having a concave-convex surface against at least a part of the metal wiring portion,
wherein
the surface of the metal member has a shape with Ra 2 /Sm of more than 0.015 μm,
the Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than a thickness of a thin metal wire located in a position where a surface roughness is measured,
the Sm represents an average distance between convex portions and is 0.01 μm or more, and
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.
2. A method for producing a transparent conductive for a touch panel film comprising:
a step of forming a metal wiring portion on a support and
a calender step of pressing a metal member having a concave-convex surface against at least a part of the metal wiring portion,
wherein
the surface of the metal member has such a shape that Sm is equal to or smaller than a line width of a thin metal wire in at least a part of the metal wiring portion, Ra is equal to or smaller than ⅙ of a thickness of the thin metal wire measured before the calender step, and Ra 2 /Sm is more than 0.015 μm,
the Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of the thin metal wire located in a position where a surface roughness is measured,
the Sm represents an average distance between convex portions and is 0.01 μm or more, and
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.
3. A method for producing a transparent conductive for a touch panel film comprising:
a step of forming a metal wiring portion on a support and
a calender step of conveying a resin film having a concave-convex surface together with the metal wiring portion to press the resin film against at least a part of the metal wiring portion,
wherein
the surface of the resin film has a shape with Ra of more than 0.15 μm,
the Ra represents an arithmetic average roughness and is equal to or smaller than the thickness of a thin metal wire located in a position where the surface roughness is measured,
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire,
the surface of the resin film has a shape with Ra 2 /Sm of more than 0.01 μm, and
the Sm represents an average distance between convex portions and is 0.01 μm or more.
4. A method for producing a transparent conductive for a touch panel film comprising:
a step of forming a metal wiring portion on a support having a concave-convex surface,
wherein
the surface of the support has a shape with Ra of more than 0.15 μm, and Ra 2 /Sm of more than 0.02 μm,
the Ra represents an arithmetic average roughness and is equal to or smaller than a thickness of a thin metal wire located in a position where a surface roughness is measured,
the Sm represents an average distance between convex portions and is 0.01 μm or more, and
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.
5. The method according to claim 4 , wherein
the step of forming the metal wiring portion on the support contains vapor-depositing a metal on the surface of the support.
6. The method according to claim 4 , wherein
the step of forming the metal wiring portion on the support contains plating the surface of the support with a metal.