Thin film transistor substrate
View Patent ↗A thin film transistor substrate including a thin film transistor and a capacitor formed of a pair of electrodes, which includes: a first electrode above a substrate; a first insulating film above the first electrode; a second electrode above the first insulating film; a second insulating film above the second electrode; and a semiconductor layer above the second insulating film, in which the capacitor includes the first electrode as one of the pair of electrodes and the second electrode as the other of the pair of electrodes, and the thin film transistor includes the second electrode as a gate electrode, the second insulating film as a gate insulating film, and the semiconductor layer as a channel layer.
1. A thin film transistor substrate including a thin film transistor and a capacitor formed of a pair of electrodes, the thin film transistor substrate comprising:
a first electrode above a substrate;
a first insulating film above the first electrode;
a second electrode above the first insulating film;
a second insulating film above the second electrode;
a semiconductor layer above the second insulating film; and
a source electrode and a drain electrode, each at least partially above the semiconductor layer,
wherein the capacitor includes the first electrode as one of the pair of electrodes and the second electrode as an other of the pair of electrodes,
the thin film transistor includes the second electrode as a gate electrode, the second insulating film as a gate insulating film, the semiconductor layer as a channel layer, and the source electrode and the drain electrode,
one of the source electrode and the drain electrode is directly connected to the first electrode, and
a first interconnecting layer of the thin film transistor includes only the first electrode, with the first electrode comprising a continuous layer which is directly connected to the one of source electrode and the drain electrode.
2. The thin film transistor substrate according to claim 1 , further comprising:
a third insulating film above the semiconductor layer,
wherein the one of the source electrode and the drain electrode is directly connected to the first electrode via a through hole extending through the first insulating film, the second insulating film, and the third insulating film.
3. The thin film transistor substrate according to claim 2 ,
wherein a hole diameter of the through hole extending through the third insulating film is greater than a hole diameter of the through hole extending through the second insulating film, and
the hole diameter of the through hole extending through the second insulating film is greater than a hole diameter of the through hole extending through the first insulating film.
4. The thin film transistor substrate according to claim 2 ,
wherein the source electrode and the drain electrode are directly connected to the semiconductor layer via second through holes extending through the third insulating film.
5. The thin film transistor substrate according to claim 4 ,
wherein a hole diameter of the through hole via which the one of the source electrode and the drain electrode is directly connected to the first electrode is greater than hole diameters of the second through holes via which the source electrode and the drain electrode are directly connected to the semiconductor layer.
6. The thin film transistor substrate according to claim 1 ,
wherein the second electrode has a width smaller than a width of the first electrode.
7. The thin film transistor substrate according to claim 1 ,
wherein the thin film transistor substrate has a plurality of pixels arranged in a matrix,
capacitors and thin film transistors are provided, each of the capacitors being the capacitor, each of the thin film transistors being the thin film transistor and serving as a drive transistor, and
each of the pixels includes one of the capacitors and one of the thin film transistors.
8. The thin film transistor substrate according to claim 1 ,
wherein the one of the source electrode and the drain electrode is directly connected to the first electrode via a through hole extending through the first insulating film and the second insulating film.
9. The thin film transistor substrate according to claim 8 ,
wherein a hole diameter of the through hole extending through the second insulating film is greater than a hole diameter of the through hole extending through the first insulating film.
10. A thin film transistor substrate including a thin film transistor and a capacitor formed of a pair of electrodes, the thin film transistor substrate comprising:
a first electrode above a substrate;
a first insulating film above the first electrode;
a second electrode above the first insulating film;
a second insulating film above the second electrode;
a semiconductor layer above the second insulating film;
a third insulating film above the semiconductor layer; and
a source electrode and a drain electrode, each at least partially above the semiconductor layer,
wherein the capacitor includes the first electrode as one of the pair of electrodes and the second electrode as an other of the pair of electrodes,
the thin film transistor includes the second electrode as a gate electrode, the second insulating film as a gate insulating film, the semiconductor layer as a channel layer, and the source electrode and the drain electrode,
one of the source electrode and the drain electrode is directly connected to the first electrode via a through hole extending through the first insulating film, the second insulating film, and the third insulating film,
the source electrode and the drain electrode are directly connected to the semiconductor layer via second through holes extending through the third insulating film, and
a hole diameter of the through hole via which the one of the source electrode and the drain electrode is directly connected to the first electrode is greater than hole diameters of the second through holes via which the source electrode and the drain electrode are directly connected to the semiconductor layer.