Electronic circuit assembly having a carrier with holes therein for receiving and connecting waveguides having different dielectric constants
View Patent ↗An electronic circuit assembly comprising: i) a circuit card assembly (CCA) having circuits integrated on a circuit surface; ii) a housing having an upper surface and a lower surface disposed on the CCA circuit surface, the housing comprising a via extending from the lower surface to the upper surface; and iii) a waveguide assembly disposed in the via. The waveguide assembly comprises: a) a first waveguide having a first dielectric value, a contact end of the first waveguide configured to make contact with the CCA circuit surface; b) a second waveguide having a second dielectric value, wherein the first dielectric value is greater than the second dielectric value; and c) a carrier for holding the first waveguide in contact with the second waveguide. The electronic circuit assembly further comprises: iv) a wave washer disposed in the via on a support surface of the carrier; and v) a third waveguide having a third dielectric value that is less than the second dielectric value. The third waveguide is disposed in the via between an end of the second waveguide and the upper surface of the housing. The wave washer presses apart the third waveguide and the waveguide assembly such that the contact end of the first waveguide is pressed into contact with the CCA circuit surface and the third waveguide is pressed into contact with an external circuit disposed above the housing.
1. A waveguide assembly comprising:
a first waveguide having a first dielectric constant value;
a second waveguide having a second dielectric constant value, wherein the first dielectric constant value is greater than the second dielectric constant value; and
a carrier for holding the first waveguide in contact with the second waveguide;
wherein a first surface of the carrier comprises a recess in which the second waveguide is positioned and wherein a portion of the carrier forms a hole that extends from the recess to a second surface of the carrier, wherein the first waveguide is inserted into the hole in order to make contact with the second waveguide positioned in the recess.
2. The waveguide assembly as set forth in claim 1 , wherein the carrier is metallic.
3. The waveguide assembly as set forth in claim 1 , wherein the first waveguide and the second waveguide are bonded to the carrier.
4. An electronic circuit assembly comprising:
a circuit card assembly having circuits integrated on a circuit surface thereof;
a housing having an upper surface and a lower surface, the lower surface disposed on the circuit surface of the circuit card assembly, the housing comprising a via extending from the lower surface to the upper surface;
a waveguide assembly disposed in the via, the waveguide assembly comprising:
a first waveguide having a first dielectric constant value, a contact end of the first waveguide configured to make contact with the circuit surface of the circuit card assembly;
a second waveguide having a second dielectric constant value, wherein the first dielectric constant value is greater than the second dielectric constant value; and
a carrier for holding the first waveguide in contact with the second waveguide;
a wave washer disposed in the via on a support surface of the carrier; and
a third waveguide having a third dielectric constant value, wherein the second constant dielectric constant value is greater than the third constant dielectric value, and wherein the third waveguide is disposed in the via between an end of the second waveguide and the upper surface of the housing.
5. The electronic circuit assembly as set forth in claim 4 , wherein the carrier is metallic.
6. The electronic circuit assembly as set forth in claim 4 , wherein the wave washer acts to press apart the third waveguide and the waveguide assembly such that the contact end of the first waveguide is pressed into contact with the circuit surface of the circuit card assembly.
7. The electronic circuit assembly as set forth in claim 6 , wherein a first surface of the carrier comprises a recess in which the second waveguide is positioned and wherein a portion of the carrier forms a hole that extends from the recess to a second surface of the carrier, wherein the first waveguide is inserted into the hole in order to make contact with the second waveguide positioned in the recess.
8. The electronic circuit assembly as set forth in claim 7 , wherein the first waveguide and the second waveguide are bonded to the carrier.