Memory component, memory device, and method of operating memory device
A memory component including first and second electrodes with a memory layer therebetween, the memory layer having first and second memory layers, the first memory layer containing aluminum and a chalcogen element of tellurium, the second memory layer between the first memory layer and the first electrode and containing an aluminum oxide and at least one of a transition metal oxide and a transition metal oxynitride having a lower resistance than the aluminum oxide.
1. A memory device comprising:
a first electrode;
a second electrode; and
a memory layer between the first and second electrodes,
wherein,
the memory layer includes (a) a first memory layer an ion source material, and (b) a second memory layer between the first memory layer and the first electrode and containing an aluminum oxide and a transition metal oxide, a transition metal oxynitride, or both,
the first memory layer has a first sub layer comprising aluminum, a chalcogen element and a transition metal element, and a second sublayer comprising aluminum and a chalcogen element, the second sublayer of the first memory layer being between the second memory layer and the first sublayer of the first memory layer,
the second memory layer has a first sublayer made of at least one of a transition metal oxide or a transition metal oxynitride and a second sublayer containing the aluminum oxide as its main component, the second sublayer being between the first sublayer and the first electrode, and
the aluminum oxide and the transition metal oxide, the transition metal oxynitride, or both are present in the first sub layer of the second memory layer in a mixed state.
2. The memory device of claim 1 , wherein the first memory layer contains a chalcogen element selected from the group consisting of tellurium (Te), sulfur (S) and selenium (Se).
3. The memory device of claim 1 , wherein the transition metal oxide or the transition metal oxynitride is at least one oxide or oxynitride of a transition metal selected from the group consisting of titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), and tungsten (W).
4. The memory device of claim 1 , wherein:
the first memory layer contains a chalcogen element selected from the group consisting of tellurium (Te), sulfur (S), and selenium (Se) together with aluminum (Al), and
the first memory layer includes a metal element from the group consisting of copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), cobalt (Co), manganese (Mn), iron (Fe), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), and tungsten (W).
5. The memory device of claim 1 , wherein the first memory layer has a first sub layer comprising aluminum, a chalcogen element and a transition metal element, and a second sublayer comprising aluminum and a chalcogen element, the second sublayer of the first memory layer being between the second memory layer and the first sublayer of the first memory layer.
6. The memory device of claim 1 , wherein the second sublayer of the first memory layer contains at least one transition metal element selected from the group consisting of zirconium (Zr), copper (Cu), chromium (Cr), manganese (Mn), titanium (Ti), and hafnium (Hf).
7. The memory device of claim 1 , wherein the first memory layer includes oxygen.
8. The memory device of claim 1 , wherein the second sublayer of the first memory layer includes oxygen (O) and at least one transition metal element selected from the group consisting of copper (Cu), titanium (Ti), zirconium (Zr), hafnium (Hf), chromium (Cr), and manganese (Mn).
9. The memory device of claim 1 , wherein information is stored using a change in an electrical characteristic of the memory layer caused by at least one of a redox reaction of aluminum oxide in response to application of a voltage to the first electrode and the second electrode and a movement of ions in the first memory layer.
10. The memory device of claim 1 , wherein a metal element contained in the first memory layer is at least one element selected from the group consisting of copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), cobalt (Co), manganese (Mn), iron (Fe), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), and tungsten (W).
11. The memory device of claim 1 , wherein the first electrode is made of at least one transition metal selected from the group consisting of titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), and tungsten (W) or a nitride thereof.
12. A memory device comprising:
a first electrode;
a second electrode; and
a memory layer between the first and second electrodes,
wherein,
the memory layer includes (a) a first memory layer an ion source material, and (b) a second memory layer between the first memory layer and the first electrode and containing an aluminum oxide and a transition metal oxide, a transition metal oxynitride, or both,
aluminum is present in the first memory layer in the amount of 30 to 50 at. %;
the transition metal is present in the first memory layer in the amount of 7.5 to 26 at. %;
Ge is present in the first memory layer in the amount of at most 15 at. %; and
Si is present in the first memory layer in the amount of 10-45 at. %.