IP Library Granted Patent US 10,264,712
Granted Patent B2
US 10,264,712 · App. 14/950,635 · Granted Apr 16, 2019

Harvesting facility water for pumping secondary fluid flow

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Quick Facts
Patent No.
US 10,264,712
App. No.
14/950,635
Granted
Apr 16, 2019
Kind
B2
Abstract

The embodiments described herein relate to generating fluid flow. A pump is positioned adjacent to a heat source. The pump includes a primary chamber having a primary rotational element configured to rotate on an axis, and a secondary chamber having a secondary rotational element configured to rotate on the axis, with a heat transfer element positioned between the primary chamber and the secondary chamber. The primary rotational element is coupled with the secondary rotational element along the axis. A primary fluid is received in the primary chamber with a primary fluid flow, which rotates the primary rotational element. A secondary fluid flow is generated in the secondary chamber by the primary rotational element causing a rotation of the secondary rotational element on the axis.

Claims (26)

1. A method comprising:

enveloping a pump within a heat source, the pump comprising:

a primary chamber, the primary chamber comprising a primary rotational blade configured to rotate on an axis;

a secondary chamber, the secondary chamber comprising a secondary rotational blade configured to rotate on the axis; and

a plate that enhances heat transfer positioned between the primary chamber and the secondary chamber;

rotatably coupling the primary rotational blade with the secondary rotational blade on a common rotational shaft extending through the heat transfer plate along the axis;

receiving a primary fluid in the primary chamber with a primary fluid flow, and the primary fluid flow rotating the primary rotational blade;

generating a secondary fluid flow in the secondary chamber, including the primary rotational blade causing a rotation of the secondary rotational blade; and

positioning a heat exchanger in communication with the pump, the heat exchanger including a primary channel in communication with the primary chamber of the pump to receive the primary fluid flow, and a secondary channel in communication with the secondary chamber of the pump to receive the secondary fluid flow, wherein the secondary fluid absorbs heat generated by the heat source and transfers the absorbed heat to the primary fluid across the heat exchanger, wherein the heat exchanger is enclosed within the heat source.

2. The method of claim 1 , wherein the plate is an impervious barrier separating the first and second chambers.

3. The method of claim 1 , wherein the primary fluid is received at a first temperature, and wherein the secondary fluid is at a second temperature greater than the first temperature.

4. The method of claim 1 , further comprising the primary fluid passing through the primary chamber simultaneously with the secondary fluid passing through the secondary chamber.

5. The method of claim 1 , further comprising positioning the pump and the heat exchanger in communication with a server rack mount.

6. The method of claim 5 , further comprising positioning the pump and the heat exchanger as a unit within the server rack mount, and in communication with a separately mounted unit within the rack.

7. A system comprising:

a pump enclosed within a heat source, the pump comprising:

a primary chamber comprising a primary rotational blade configured to rotate on an axis, the primary chamber to receive a primary fluid with a primary fluid flow, wherein the primary fluid flow rotates the primary rotational blade;

a secondary chamber, the secondary chamber comprising a secondary rotational blade configured to rotate on the axis, wherein the primary rotational blade is rotatably coupled with the secondary rotational blade on a common rotational shaft along the axis, and wherein the primary rotational blade causes a rotation of the secondary rotational blade to generate a secondary fluid flow in the secondary chamber;

a plate that enhances heat transfer positioned between the primary chamber and the secondary chamber, wherein the common rotational shaft extends through the heat transfer plate; and

a heat exchanger positioned in communication with the pump, the heat exchanger including a primary channel in communication with the primary chamber of the pump to receive the primary fluid flow, and a secondary channel in communication with the secondary chamber of the pump to receive the secondary fluid flow, wherein the secondary fluid absorbs heat generated by the heat source and transfers the absorbed heat to the primary fluid across the heat exchanger, wherein the heat exchanger is enclosed within the heat source.

8. The system of claim 7 , wherein the heat transfer element is an impervious barrier comprised of a heat conductive medium, wherein the heat transfer plate separates the first and second chambers.

9. The system of claim 7 , wherein the primary fluid is received at a first temperature, and wherein the secondary fluid is at a second temperature greater than the first temperature.

10. The system of claim 7 , wherein the primary fluid passes through the primary chamber and the secondary fluid passes through the secondary chamber simultaneously.

11. The system of claim 10 , wherein the unit is a chiller distribution unit (CDU).

12. The system of claim 7 , further comprising a server rack mount, wherein the pump and the heat exchanger are positioned in communication with the server rack mount.

13. The system of claim 12 , wherein the pump and the heat exchanger are positioned as a unit within the server rack mount, and in communication with a separately mounted unit within the server rack mount.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2019
From: LENOVO (SINGAPORE) PTE LTD
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 051024/0514 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2015
From: MATTESON, JASON A.; STEINKE, MARK E.
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 037133/0488 →