Device and method for alignment of vertically stacked wafers and die

1. A method of aligning a plurality of die, comprising:

positioning a first die having a first plurality of alignment structures overlying a second die having a second plurality of alignment structures, the first plurality of alignment structures having a first plurality of transmission columns arranged in a first pattern having a position of each one of the first plurality of transmission columns set with respect to each other and the second plurality of alignment structures having a second plurality of transmission columns arranged in a second pattern having a position of each one of the second plurality of transmission columns set with respect to each other, the first pattern being the same as the second pattern, the first and the second die being in direct physical contact;

applying a first signal to the first plurality of alignment structures;

detecting a second signal at the second plurality of alignment structures;

determining a difference between the first and second signals; and

adjusting a position of the first die with respect to the second die to decrease the difference between the first and second signals.

2. The method of claim 1 wherein applying the first signal and detecting the second signal include applying the first signal to a first end of each of the first transmission columns and detecting the second signal at a second end of each of the second transmission columns, a second end of each of the first transmission columns in electrical communication with a first end of each of the second transmission columns.

3. The method of claim 2 wherein determining the difference between the first and second signals includes determining a resistance between the first end of each of the first transmission columns and the second end of each of the second transmission columns.

4. A method, comprising:

forming a plurality of first transmission columns in a first wafer, the first transmission columns arranged in a first pattern having a position of each one of the first transmission columns set with respect to each other;

forming a plurality of second transmission columns in a second wafer, the second transmission columns arranged in a second pattern having a position of each one of the second transmission columns set with respect to each other, the first pattern being the same as the second pattern;

aligning the first wafer with the second wafer by directly physically contacting the plurality of first transmission columns to the plurality of second transmission columns and matching the first pattern with the second pattern, the aligning including:

applying a signal to the first transmission columns;

detecting the signal at the second transmission columns; and

adjusting a position of the first wafer with respect to the second wafer to more precisely align the pattern.

5. The method of claim 4 wherein the aligning includes determining a difference between a first value of the signal applied to the first transmission columns and a second value of the signal detected at the second transmission columns.

6. The method of claim 5 wherein adjusting the position includes decreasing the difference between the first and second values.

7. The method of claim 4 wherein applying the signal includes applying an optical signal to an end of at least one of the first transmission columns.

8. The method of claim 7 wherein detecting the signal includes detecting the optical signal passing through the at least one of the first plurality of alignment structures at an end of one of the second plurality of alignment structures.

9. The method of claim 4 wherein forming the plurality of first transmission columns includes forming a first end of the first transmission columns extending from a first surface of the first wafer by a first distance.

10. The method of claim 9 wherein forming the plurality of first transmission columns includes forming a second end of the first transmission columns extending from a second surface of the first wafer by a second distance.

11. The method of claim 9 wherein forming the plurality of first transmission columns includes forming the first ends and second ends of the first transmission columns not overlaying any portion of the first and second surface of the first wafer.

12. The method of claim 9 wherein forming the plurality of second transmission columns includes forming a first end of the second transmission columns extending from a first surface of the second wafer by a second distance.

13. The method of claim 12 , further comprising arranging the first wafer and the second wafer to have the first end of the first transmission columns facing the first end of the second transmission columns.

14. The method of claim 12 wherein forming the plurality of second transmission columns includes forming a second end of the second transmission columns extending from a second surface of the second wafer by a third distance.

15. The method of claim 4 wherein forming the plurality of first transmission columns includes forming a first one of the first transmission columns from a first material and forming a second one of the first transmission columns from a second material that is different from the first material.

16. A method, comprising:

forming a first alignment column, a second alignment column, and a third alignment column each in a first die, a top side of each of the first, second and third alignment columns being coplanar and a portion of each of the first, second and third alignment columns extending away from a side of the first die;

forming a fourth alignment column, a fifth alignment column, and a sixth alignment column each in a second die, a bottom side of each of the fourth, fifth, and sixth alignment columns being coplanar and a portion of each of the fourth, fifth and sixth alignment columns extending away from a side of the second die.

17. The method of claim 16 , wherein the portion of the first alignment column extends out of a top side of the first die and the portion of the fourth alignment column extends out of a bottom side of the second die.

18. The method of claim 16 , further comprising:

aligning the first die to the second die, the aligning including:

applying a signal to the first, second, and the third alignment columns; and

reading the signal from the first alignment column at the fourth alignment column, the signal from the second alignment column at the fifth alignment column, and the signal from the third alignment column at the sixth alignment column.

19. The method of claim 16 , wherein the first alignment column is formed from a first material, and the second alignment column is formed from a second material, the first material different from the second material.

20. A method, comprising:

forming a first alignment column, a second alignment column, and a third alignment column each in a first die, a top side of each of the first, second and third alignment columns being coplanar and adjacent to a top side of the first die, wherein a first distance between the first alignment column and the second alignment column added to a second distance between the second alignment column and the third alignment column does not equal a third distance between the first alignment column and the third alignment column;

forming a fourth alignment column, a fifth alignment column, and a sixth alignment column each in a second die, a bottom side of each of the fourth, fifth, and sixth alignment columns being coplanar and adjacent to a bottom side of the second die; and

aligning the first die to the second die, the aligning including:

applying a signal to the first, second, and the third alignment columns; and

reading the signal from the first alignment column at the fourth alignment column, the signal from the second alignment column at the fifth alignment column, and the signal from the third alignment column at the sixth alignment column.

21. The method of claim 18 , wherein applying a signal includes applying an optical signal to the first, second, and third alignment columns at a bottom side of the first die, the bottom side of the first die opposite the top side of the first die.

22. The method of claim 20 , further comprising:

aligning the first die to the second die, the aligning including:

applying a signal to the first, second, and the third alignment columns; and

reading the signal from the first alignment column at the fourth alignment column, the signal from the second alignment column at the fifth alignment column, and the signal from the third alignment column at the sixth alignment column.

23. The method of claim 20 , wherein a portion of the first alignment column extends out of a top side of the first die and a portion of the fourth alignment column extends out of a bottom side of the second die.