Method for manufacturing a light emitted diode display
A method for manufacturing a micro LED display is provided. The method includes providing a plurality of LED elements on a first substrate, transferring, using a magnetic holder or a vacuum holder, at least two of the plurality of LED elements of the same primary color from the first substrate to a second substrate, performing the steps of the providing and the transferring with respect to three primary colors, forming an array of RGB LED units on the second substrate, each of the array of RGB LED units including a red LED element, a green LED element, and a blue LED element, interposing the array of RGB LED units between the second substrate and an LED driver wafer, detaching the second substrate from the array of RGB LED units, and interposing the array of RGB LED units between the LED driver wafer and a cover.
1. A micro-light emitting diode (LED) display comprising:
a first substrate;
a red LED pixel, a green LED pixel, and a blue LED pixel disposed on the first substrate and having a pitch smaller than a predetermined size;
a second substrate having disposed thereon a first electrode, a second electrode, and a third electrode configured to be electrically coupled to the red LED pixel, the green LED pixel, and the blue LED pixel, respectively; and
an anisotropic conductive film (ACF) layer filling a gap between the first substrate and the second substrate and simultaneously contacting the first substrate and the second substrate, wherein the ACF layer comprises conductive particles.
2. The method of claim 1 , wherein each of the array of RGB LED units comprises the red LED pixel, the green LED pixel, and the blue LED pixel arranged in a row.
3. The micro-LED display of claim 1 , wherein the pitch is smaller than 100 μm.
4. The micro-LED display of claim 1 , wherein the conductive particles are nano-sized metal particle.
5. The micro-LED display of claim 1 , wherein the first substrate is cover glass or touch sensitive panel.