Electronic device with hollowed-out rear plate
An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.
1. An electronic device comprising:
a rear plate comprising a substrate rear layer, a substrate front layer and a dielectric intermediate layer between said substrate rear and front layers;
an electronic structure on the substrate front layer and comprising electronic components and electrical connections; and
said substrate rear layer including at least one solid local region and at least one hollowed-out local region, with the at least one hollowed-out local region extending over an entire thickness of said substrate rear layer so that said substrate rear layer does not cover at least one local zone of a rear face of said dielectric intermediate layer, with the at least one local zone corresponding to the at least one hollowed-out local region.
2. The electronic device according to claim 1 , wherein said electronic structure comprises at least one external electrical contact pad; and wherein said at least one solid local region extends over an entire thickness of said rear plate and overlies said at least one external electrical contact pad.
3. The electronic device according to claim 1 , wherein said at least one hollowed-out local region overlies at least one of said electronic components of said electronic structure.
4. The electronic device according to claim 1 , further comprising at least one dielectric filling material filling said at least one hollowed-out local region.
5. The electronic device according to claim 4 , wherein said at least one solid local region has a rear face; and wherein said at least one dielectric filling material has a rear face aligned with the rear face of said at least one solid local region.
6. The electronic device according to claim 4 , wherein said at least one solid local region has a rear face; wherein said dielectric filling material covers the rear face of said at least one solid region; and wherein said dielectric filling material has a rear face parallel to the rear face of said at least one solid local region.
7. The electronic device according to claim 4 , further comprising an intermediate layer between said at least one dielectric filling material and said at least one solid local region and said dielectric intermediate layer.
8. The electronic device according to claim 1 , wherein said at least one solid local region comprises at least one of a plurality of pillars and a honeycomb-shaped partitioning.
9. An electronic device comprising:
a rear plate comprising a substrate rear layer, a substrate front layer and a dielectric intermediate layer between said substrate rear and front layers;
an electronic structure on the substrate front layer, said electronic structure comprising at least one external electrical contact pad, electronic components and electrical connections; and
said substrate rear layer including at least one solid local region and at least one hollowed-out local region,
with the at least one hollowed-out local region extending over an entire thickness of said substrate rear layer so that said substrate rear layer does not cover at least one local zone of said dielectric intermediate layer, the at least one hollowed-out local region overlying at least one of said electronic components, and
with said at least one solid local region extending over an entire thickness of said rear plate and overlying said at least one external electrical contact pad.
10. The electronic device according to claim 9 , further comprising at least one dielectric filling material filling said at least one hollowed-out local region.
11. The electronic device according to claim 10 , wherein said at least one solid local region has a rear face; and wherein said at least one dielectric filling material has a rear face aligned with the rear face of said at least one solid local region.
12. The electronic device according to claim 10 , wherein said at least one solid local region has a rear face; wherein said dielectric filling material covers the rear face of said at least one solid region; and wherein said dielectric filling material has a rear face parallel to the rear face of said at least one solid local region.
13. The electronic device according to claim 10 , further comprising an intermediate layer between said at least one dielectric filling material and said at least one solid local region and said dielectric intermediate layer.
14. The electronic device according to claim 9 , wherein said at least one solid local region comprises at least one of a plurality of pillars and a honeycomb-shaped partitioning.
15. A method of making an electronic device, the method comprising:
providing a plate including a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers, and an electronic structure on the substrate front layer comprising electronic components and electrical connections;
removing, down to the dielectric intermediate layer, a portion of the substrate rear layer so as to define at least one hollowed-out local region and at least one solid local region; and
wherein the at least one hollowed-out local region extends over an entire thickness of the substrate rear layer so that the substrate rear layer does not cover at least one local zone of a rear face of the dielectric intermediate layer, with the at least one local zone corresponding to the at least one hollowed-out local region.
16. The method according to claim 15 , wherein the electronic structure comprises at least one external electrical contact pad; and wherein the at least one solid local region extends over an entire thickness of the rear plate and overlies the at least one external electrical contact pad.
17. The method according to claim 15 , wherein the at least one hollowed-out local region overlies at least one of the electronic components of the electronic structure.
18. The method according to claim 15 , further comprising filling the at least one hollowed-out local region with at least one dielectric filling material filling.
19. The method according to claim 18 , wherein the at least one solid local region has a rear face; and wherein the at least one dielectric filling material has a rear face aligned with the rear face of the at least one solid local region.
20. The method according to claim 18 , wherein the at least one solid local region has a rear face; wherein the dielectric filling material covers the rear face of the at least one solid region; and wherein the dielectric filling material has a rear face parallel to the rear face of the at least one solid local region.
21. The method according to claim 18 , further comprising forming an intermediate layer between the at least one dielectric filling material and the at least one solid local region and the dielectric intermediate layer.
22. The method according to claim 15 , wherein the at least one solid local region comprises at least one of a plurality of pillars and a honeycomb-shaped partitioning.