HEAT-DISSIPATION SYSTEM
The disclosure heat-dissipation system for a server provides a refrigeration tank configured for containing a refrigerant, a electrical component installed inside of the refrigeration tank submerged by the refrigerant and converts the refrigerant to a vapor, a cooling device installed outside of the refrigeration tank. A heat exchanger is coupled to the cooling device and installed outside of the refrigeration tank, the heat exchanger obtains the vapor from the refrigeration tank; wherein the heat exchanger exchanges the heated fluid formed by the vapor with the cooling device, for cooling the heated fluid, to return to the refrigeration tank.
1 . A heat-dissipation system comprising:
a refrigeration tank configured for containing a refrigerant;
an electrical component installed inside of the refrigeration tank and submerged in the refrigerant and configured for converting the refrigerant to a vapor;
a cooling device installed outside of the refrigeration tank; and
a heat exchanger coupled to the cooling device and installed outside of the refrigeration tank, the heat exchanger configured to receive the vapor from the refrigeration tank, wherein the heat exchanger exchanges the hot fluid formed by the vapor with the cooling device, thereby cooling the hot fluid to a cold fluid to return for the refrigeration tank.
2 . The heat-dissipation system of claim 1 , further comprising a fan coupled between the refrigeration tank and the heat exchanger, wherein the heat exchanger receives the vapor from the refrigeration tank through the fan.
3 . The heat-dissipation system of claim 1 , further comprising a gas-liquid separator, the gas-liquid separator is configured to receive the refrigerant and refrigerant vapor from the heat exchanger.
4 . The heat-dissipation system of claim 3 , further comprising a water pump, the water pump is configured to pump the refrigerant from the gas-liquid separator back to the refrigeration tank.
5 . The heat-dissipation system of claim 1 , wherein the electrical component is a motherboard of a server.
6 . The heat-dissipation system of claim 1 , wherein the cooling device is a cooling tower.
7 . The heat-dissipation system of claim 1 , wherein the refrigerant is an electric insulation refrigerant.
8 . The heat-dissipation system of claim 7 , wherein the boiling point of the electric insulation refrigerant is between 30 centigrade with 60 centigrade.
9 . A heat-dissipation system comprising:
a refrigeration tank configured for containing a refrigerant;
an electrical component installed inside of the refrigeration tank and submerged in the refrigerant and configured for converting the refrigerant to a vapor;
a fan coupled to the refrigeration tank;
a cooling device installed outside of the refrigeration tank; and
a heat exchanger coupled to the cooling device and installed outside of the refrigeration tank, the heat exchanger configured to receive the vapor from the refrigeration tank through the fan, wherein the heat exchanger exchanges the hot fluid formed by the vapor with the cooling device, thereby cooling the hot fluid to a cold fluid to return to for refrigeration tank.
10 . The heat-dissipation system of claim 9 , further comprising a gas-liquid separator, the gas-liquid separator is configured to receive the refrigerant and refrigerant vapor from the heat exchanger.
11 . The heat-dissipation system of claim 9 , further comprising a water pump, the water pump is configured to pump the refrigerant from the gas-liquid separator back to the refrigeration tank.