Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

1. A method for producing a surface-mountable component, the method comprising:

providing a chip carrier, wherein a cavity is disposed in the chip carrier;

arranging an optoelectronic semiconductor chip in the cavity and such that the optoelectronic semiconductor chip is fixed to a base surface of the cavity;

arranging the chip carrier on an auxiliary carrier;

forming a contact structure on the auxiliary carrier with the contact structure directly adjoining the auxiliary carrier, wherein, after the contact structure is formed, the contact structure is laterally spaced apart from the chip carrier without overlapping the chip carrier in a top view that is relative to the surface-mountable component;

arranging the auxiliary carrier with the chip carrier in a forming mold, wherein the forming mold seals against a surface of the chip carrier such that the cavity is closed hermetically by the forming mold and a top surface of the chip carrier;

providing a molding composition in a portion of the forming mold outside of the cavity, wherein, after providing the molding composition in the portion of the forming mold, the molding composition is molded at least in places onto the chip carrier outside the cavity, and wherein the chip carrier and the contact structure are joined together mechanically by the molding composition;

removing the forming mold; and

removing the auxiliary carrier.

2. The method according to claim 1 , wherein the chip carrier comprises an outer side face that extends from the top to the bottom of the chip carrier, wherein the outer side face is completely surrounded by the molding composition.

3. The method according to claim 1 , wherein filling the forming mold comprises injection molding or transfer molding.

4. The method according to claim 1 , further comprising providing the semiconductor chip with a covering, wherein the covering completely covers the molding composition.

5. The method according to claim 4 , wherein the covering is provided after removing the auxiliary carrier.

6. The method according to claim 4 , wherein the chip carrier comprises an anchoring structure onto which the covering is molded.

7. The method according to claim 1 , wherein the semiconductor chip is arranged completely within the cavity during the arranging the auxiliary carrier with the chip carrier in the forming mold.

8. The method according to claim 1 , wherein the chip carrier comprises an anchoring structure onto which the molding composition is molded.

9. The method according to claim 1 , wherein during fabrication of the surface-mountable component, the surface- mountable component is singulated from a matrix of neighboring component regions by severing the molding.

10. The method according to claim 9 , wherein the method further comprises providing the semiconductor chips in the component regions with a covering, wherein the covering completely covers the molding composition; and

wherein the molding composition and the covering are severed at a same time in a joint manufacturing process.

11. The method according to claim 9 , wherein the components are severed by sawing.

12. A method for producing a surface-mountable component, the method comprising:

providing a chip carrier, wherein a cavity is disposed in the chip carrier, and wherein the chip carrier has an inner anchoring structure disposed at an inner side face of the cavity;

arranging an optoelectronic semiconductor chip in the cavity with the inner side face of the cavity facing the optoelectronic semiconductor chip;

arranging the chip carrier on an auxiliary carrier;

arranging the auxiliary carrier with the chip carrier in a forming mold, wherein the forming mold seals against a surface of the chip carrier such that the cavity is closed hermetically by the forming mold and a top surface of the chip carrier;

providing a molding composition in a portion of the forming mold outside of the cavity, wherein, after providing the molding composition in the portion of the forming mold, the molding composition is molded at least in places onto the chip carrier outside the cavity;

removing the forming mold;

providing the semiconductor chip with a covering directly adjoining the optoelectronic semiconductor chip, wherein the covering completely covers the molding composition, and wherein the covering is molded onto the inner anchoring structure; and

removing the auxiliary carrier.