IP Library Granted Patent US 9,691,870
Granted Patent B2
US 9,691,870 · App. 14/959,944 · Granted Jun 27, 2017

Semiconductor device

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Quick Facts
Patent No.
US 9,691,870
App. No.
14/959,944
Granted
Jun 27, 2017
Kind
B2
Abstract

A semiconductor device including a semiconductor substrate and an electrode formed from an alloy containing aluminum, silicon and titanium. The silicon content in the electrode is from 0.5 to 1.0% by weight relative to the total weight of the electrode, the titanium content in the electrode is from 0.8 to 3.0% by weight relative to the total weight of the electrode, and the thickness of the electrode is at least 1 μm.

Claims (47)

1. A semiconductor device comprising:

a semiconductor substrate, and

an electrode formed from an alloy containing aluminum, silicon and titanium, wherein

a content of the silicon in the electrode is from 0.5 to 1.0% by weight relative to a total weight of the electrode,

a content of the titanium in the electrode is from 0.8 to 3.0% by weight relative to the total weight of the electrode, and

a thickness of the electrode is at least 1 μm.

2. The semiconductor device according to claim 1 , wherein

an average particle size of metal crystals contained in the electrode is not more than 1 μm.

3. The semiconductor device according to claim 1 , wherein

an average particle size of metal crystals contained in the electrode is not more than 0.8 μm.

4. The semiconductor device according to claim 1 , wherein

the content of the titanium in the electrode is from 0.8 to 2.0% by weight relative to the total weight of the electrode.

5. The semiconductor device according to claim 2 , wherein

the content of the titanium in the electrode is from 0.8 to 2.0% by weight relative to the total weight of the electrode.

6. The semiconductor device according to claim 3 , wherein

the content of the titanium in the electrode is from 0.8 to 2.0% by weight relative to the total weight of the electrode.

7. The semiconductor device according to claim 1 , wherein

at least a portion of the silicon contained in the electrode is in a state not dissolved in the aluminum.

8. The semiconductor device according to claim 2 , wherein

at least a portion of the silicon contained in the electrode is in a state not dissolved in the aluminum.

9. The semiconductor device according to claim 3 , wherein

at least a portion of the silicon contained in the electrode is in a state not dissolved in the aluminum.

10. The semiconductor device according to claim 4 , wherein

at least a portion of the silicon contained in the electrode is in a state not dissolved in the aluminum.

11. The semiconductor device according to claim 5 , wherein

at least a portion of the silicon contained in the electrode is in a state not dissolved in the aluminum.

12. The semiconductor device according to claim 6 , wherein

at least a portion of the silicon contained in the electrode is in a state not dissolved in the aluminum.

13. The semiconductor device according to claim 1 , wherein

a content of the aluminum in the electrode is from 96.0 to 98.7% by weight relative to the total weight of the electrode.

14. The semiconductor device according to claim 1 , wherein

the thickness of the electrode is at least 1 μm and no more than 10 μm.

15. The semiconductor device according to claim 14 , wherein

the thickness of the electrode is at least 3 μm.

16. The semiconductor device according to claim 1 , wherein

the thickness of the electrode is at least 3 μm and no more than 8 μm.

17. The semiconductor device according to claim 1 , wherein

the thickness of the electrode is at least 4 μm and no more than 6 μm.

18. A semiconductor device comprising:

a semiconductor substrate, and

an electrode formed from an alloy containing aluminum, silicon and titanium, wherein

a content of the silicon in the electrode is from 0.5 to 1.0% by weight relative to a total weight of the electrode,

a content of the titanium in the electrode is from 0.8 to 3.0% by weight relative to the total weight of the electrode,

a content of the aluminum in the electrode is from 96.0 to 98.7% by weight relative to the total weight of the electrode, and

a thickness of the electrode is at least 1 μm and no more than 10 μm.

19. The semiconductor device according to claim 18 , wherein

the thickness of the electrode is at least 3 μm.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: TOYOTA JIDOSHA KABUSHIKI KAISHA
To: DENSO CORPORATION
Reel/Frame 052285/0419 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2015
From: USHIJIMA, TAKASHI; NISHIWAKI, TSUYOSHI; OKADA, MASAKAZU
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 037216/0809 →