Structural frame cooling manifold
View Patent ↗A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.
1. A variable speed drive system configured to receive as an input AC power at a fixed AC input voltage magnitude and frequency and provide an output AC power at a variable voltage and a variable frequency, the variable speed drive system comprising:
a converter adapted to be coupled to an AC power source providing the input AC voltage, the converter being configured to convert the input AC voltage to a DC voltage;
a DC link connected to the converter, the DC link being configured to filter the DC voltage and to store energy from the converter; and
an inverter connected to the DC link, the inverter being configured to convert the DC voltage from the DC link into the output AC power having the variable voltage and the variable frequency, the inverter comprising:
at least one power electronics module and associated circuitry;
a heat sink in thermal communication with the power electronics module and in cooling fluid communication with a manifold, the manifold including a hollow tubular member having at least one port for conducting the cooling fluid into the manifold and at least one port for conducting the cooling fluid out of the manifold, at least one bracket for attaching the manifold to a structural frame of the power electronics and at least one bracket for attaching a power electronics module to the manifold, whereby the manifold provides a dual function of providing structural support for the frame and support for the electronic module while simultaneously providing a conduit for the cooling fluid using the same space.
2. The variable speed drive system of claim 1 , wherein the manifold further comprises at least one vertical member portion in fluid communication with at least one horizontal member portion.
3. The variable speed drive system of claim 2 , wherein the at least one power electronics module is mounted on the horizontal member portion.
4. The variable speed drive system of claim 1 , wherein the manifold is fabricated from a non-corrosive material.
5. The variable speed drive system of claim 4 , wherein the non-corrosive material is stainless steel.
6. The variable speed drive system of claim 1 , wherein the manifold is coated with a material selected from the group consisting of polymers and ceramic.
7. The variable speed drive system of claim 1 , wherein the manifold further comprises end brackets for mounting the manifold to the frame.
8. A variable speed drive system configured to receive as an input AC power at a fixed AC input voltage magnitude and frequency and provide an output AC power at a variable voltage and a variable frequency, the variable speed drive system comprising:
a converter adapted to be coupled to an AC power source providing the input AC voltage, the converter being configured to convert the input AC voltage to a DC voltage;
a DC link connected to the converter, the DC link being configured to filter the DC voltage and to store energy from the converter; and
an inverter connected to the DC link, the inverter being configured to convert the DC voltage from the DC link into the output AC power having the variable voltage and the variable frequency, the inverter comprises:
a plurality of power electronics modules and associated circuitry;
a heat sink in thermal communication with each of the power electronics modules and in fluid communication with a manifold, the manifold including a cavity through which a cooling medium passes, at least one port for conducting the cooling medium into the manifold cavity and at least one port for conducting the cooling medium out of the manifold cavity, a bracket for attaching the manifold to a structural frame of the power electronics, and a bracket for attaching each of the power electronics modules to the manifold, whereby the manifold provides a dual function of providing structural support for the frame and support for the electronic modules while simultaneously providing a conduit for the cooling fluid using the same space.
9. The variable speed drive system of claim 8 , wherein the manifold further comprises at least one vertical member portion in fluid communication with at least one horizontal member portion.
10. The variable speed drive system of claim 9 , wherein at least one of the power electronics modules is mounted on the horizontal member portion.
11. The variable speed drive system of claim 8 , wherein the manifold is fabricated from a non-corrosive material.
12. The variable speed drive system of claim 11 , wherein the non-corrosive material is stainless steel.
13. The variable speed drive system of claim 8 , wherein the manifold is coated with a material selected from the group consisting of polymers and ceramic.
14. The variable speed drive system of claim 8 , wherein the manifold further comprises end brackets for mounting the manifold to the frame.
15. A cooling system for heat generating electronics enclosed within a housing, the electronics having at least one power electronics module and associated circuitry, the cooling system comprising:
a heat sink in thermal communication with the power electronics module and in cooling fluid communication with a manifold, the manifold including a hollow tubular member having at least one port for conducting cooling fluid into the manifold and at least one port for conducting cooling fluid out of the manifold, at least one bracket for attaching the manifold to a structural frame of the power electronics, at least one bracket for attaching the manifold to a structural frame, and a plurality of brackets for attaching power electronics modules to the manifold, whereby the manifold provides a dual function of structural support for the frame and the electronic module while simultaneously providing a conduit for the cooling fluid using the same space.
16. The cooling system of claim 15 wherein the manifold further comprises at least one vertical member portion in fluid communication with at least one horizontal member portion.
17. The cooling system of claim 16 , wherein the at least one power electronics module is mounted on the horizontal member portion.
18. The cooling system of claim 15 , wherein the manifold is fabricated from a non-corrosive material.
19. The cooling system of claim 18 , wherein the non-corrosive material is stainless steel.
20. The cooling system of claim 15 , wherein the manifold further comprises end brackets for mounting the manifold to the frame.