METHOD FOR PRODUCING WIRING BOARD
The method for producing a wiring board according to the present invention includes the steps of: preparing an insulating board including a cavity forming area and a wiring forming area; forming a first wiring conductor in the wiring forming area; forming a cavity in the cavity forming area and an opening in a part of the wiring forming area; inserting an electronic component including an external electrode into the cavity; forming insulating layers on upper and lower surfaces of the insulating board, the insulating layers filled into a gap in the cavity and into the opening; forming a through-hole penetrating through the opening from the insulating layer on an upper surface side to the insulating layer on a lower surface side; and forming a second wiring conductor on a surface of the insulating layer and in the through-hole.
1 . A method for producing a wiring board, the method comprising the steps of:
preparing an insulating board including a cavity forming area and a wiring forming area surrounding the cavity forming area;
forming a first wiring conductor in the wiring forming area;
forming a cavity in the cavity forming area and an opening connected to the cavity in a part of the wiring forming area;
inserting an electronic component including an external electrode into the cavity so that the external electrode is adjacent to the opening;
forming insulating layers on upper and lower surfaces of the insulating board, the insulating layers to be filled into a gap in the cavity to fix the electronic component and into the opening;
forming a through-hole penetrating through the opening from the insulating layer on an upper surface side to the insulating layer on a lower surface side, the external electrode being exposed to an inner surface of the through-hole; and
forming a second wiring conductor on a surface of the insulating layer and in the through-hole, the second wiring conductor electrically connected to the external electrode exposed to the inner surface.
2 . The method for producing a wiring board according to claim 1 , wherein the insulating board includes a fibrous reinforcement material.
3 . The method for producing a wiring board according to claim 2 , wherein the fibrous reinforcing material is a glass fiber.
4 . The method for producing a wiring board according to claim 1 , wherein the cavity and the opening are formed concurrently.