IP Library Granted Patent US 9,739,938
Granted Patent B2
US 9,739,938 · App. 14/963,842 · Granted Aug 22, 2017

Shielded photonic integrated circuit

Inventors: Ruizhi Shi (New York, NY); Yang Liu (Elmhurst, NY); Ari Novack (New York, NY); Yangjin Ma (Brooklyn, NY); Kishore Padmaraju (New York, NY); Michael J. Hochberg (New York, NY)
Assignee: Elenion Technologies, LLC
G02B6/12004G02B6/122G02B6/4277G02B2006/12157
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Quick Facts
Patent No.
US 9,739,938
App. No.
14/963,842
Granted
Aug 22, 2017
Kind
B2
Abstract

A light shield may be formed in photonic integrated circuit between integrated optical devices of the photonic integrated circuit. The light shield may be built by using materials already present in the photonic integrated circuit, for example the light shield may include metal walls and doped semiconductor regions. Light-emitting or light-sensitive integrated optical devices or modules of a photonic integrated circuit may be constructed with light shields integrally built in.

Claims (20)

1. A photonic integrated circuit comprising:

a substrate;

first and second integrated optical devices over the substrate; and

a light shield structure between the first and second integrated optical devices, the light shield structure comprising an opaque structure configured to suppress optical crosstalk between the first and second integrated optical devices;

wherein the light shield structure comprises a Bragg structure for out-coupling stray light; and

wherein the Bragg structure comprises a plurality of concentric walls surrounding the first integrated optical device.

2. The photonic integrated circuit of claim 1 , wherein the light shield structure comprises a metal structure.

3. The photonic integrated circuit of claim 2 , wherein the metal structure is not coplanar with the first integrated optical device.

4. The photonic integrated circuit of claim 3 , wherein the metal structure is farther away from the substrate than the first integrated optical device.

5. The photonic integrated circuit of claim 2 , wherein the first integrated optical device comprises a photodetector.

6. The photonic integrated circuit of claim 1 , wherein the opaque structure comprises a semiconductor.

7. The photonic integrated circuit of claim 1 , wherein the opaque structure comprises an optically absorbing material.

8. The photonic integrated circuit of claim 1 , wherein the first or the second integrated optical device is bonded to the substrate.

9. The photonic integrated circuit of claim 1 , wherein the first or the second integrated optical device is monolithically fabricated on the substrate.

10. The photonic integrated circuit of claim 1 , wherein the first integrated optical device comprises a waveguide Y-junction.

11. The photonic integrated circuit of claim 1 , wherein the first integrated optical device comprises a light-emitting device.

12. The photonic integrated circuit of claim 11 , wherein the second integrated optical device comprises a receiver.

13. The photonic integrated circuit of claim 11 , wherein the light emitting device comprises a semiconductor laser or a semiconductor optical amplifier chip.

14. The photonic integrated circuit of claim 1 , wherein the substrate is selected from the group consisting of Si, GaAs, and InP.

15. The photonic integrated circuit of claim 1 , wherein the first or second optical device is comprised of a material selected from the group consisting of Si, SiO 2 , doped glass, SiON, SiN, InP, GaAs, AlGaAs, InGaAsP, InGaP, InAlAs, and InGaAlAs.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2023
From: ELENION TECHNOLOGIES LLC
To: NOKIA SOLUTIONS AND NETWORKS OY
Reel/Frame 063284/0711 →
RELEASE OF SECURITY INTEREST Recorded Mar 27, 2020
From: HERCULES CAPITAL, INC.
To: ELENION TECHNOLOGIES CORPORATION; ELENION TECHNOLOGIES, LLC
Reel/Frame 052251/0186 →
SECURITY INTEREST Recorded Feb 8, 2019
From: ELENION TECHNOLOGIES, LLC; ELENION TECHNOLOGIES CORPORATION
To: HERCULES CAPITAL INC., AS AGENT
Reel/Frame 048289/0060 →
RELEASE OF SECURITY INTEREST Recorded Feb 8, 2019
From: EASTWARD FUND MANAGEMENT, LLC
To: ELENION TECHNOLOGIES CORPORATION
Reel/Frame 048290/0070 →
SECURITY INTEREST Recorded Apr 16, 2018
From: ELENION TECHNOLOGIES CORPORATION
To: EASTWARD FUND MANAGEMENT, LLC
Reel/Frame 045959/0001 →
CHANGE OF NAME Recorded Dec 8, 2016
From: CORIANT ADVANCED TECHNOLOGY, LLC
To: ELENION TECHNOLOGIES, LLC
Reel/Frame 040852/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2015
From: SHI, RUIZHI; LIU, YANG; NOVACK, ARI; MA, YANGJIN; PADMARAJU, KISHORE; HOCHBERG, MICHAEL J.
To: CORIANT ADVANCED TECHNOLOGY, LLC
Reel/Frame 037250/0195 →
Continuity (1)
Related Publication 20170168234A1 · Jun 15, 2017