Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole
View Patent ↗Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): ( d /2)/ f =tan θ (1), and 0.16≤sin θ≤0.22 (2).
1. A through hole forming method comprising:
a process of forming, by condensing and irradiating a laser beam from a carbon dioxide laser onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate,
wherein a medium between the lens and the insulation substrate is air, and
wherein a converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
( d/ 2)/ f =tan θ (1), and
0.16≤sin δ≤0.22 (2).
2. The through-hole forming method according to claim 1 ,
wherein the laser beam that enters the lens is collimating light having a circular cross-section.
3. The through-hole forming method according to claim 1 ,
wherein a distance between a focal point of the lens and a laser irradiated surface of the insulation substrate in a direction that is perpendicular to the irradiated surface is less than or equal to 0.1 mm.
4. The through-hole forming method according to claim 1 ,
wherein the through-hole has a first orifice at a laser irradiated surface of the insulation substrate, and a second orifice at a surface that is opposite to the laser irradiated surface of the insulation substrate,
wherein the second orifice is smaller than the first orifice, and
wherein a ratio (Φ1/Φ2), at any position of the through-hole in the thickness direction of the insulation substrate, between a diameter (Φ1) of the through-hole and a diameter (Φ2) of a truncated cone, a side surface of the truncated cone including the first orifice and the second orifice, is greater than or equal to 0.7 and less than or equal to 1.1.
5. The through-hole forming method according to claim 1 ,
wherein the laser beam enters the lens through an aperture.
6. The through-hole forming method according to claim
wherein polarization of the laser beam is converted from linear polarization to circular polarization, and the circularly polarized laser beam is irradiated onto the insulation substrate.
7. The through-hole forming method according to claim 1 ,
wherein the insulation substrate includes a glass substrate.
8. The through-hole forming method according to claim 1 , further comprising:
a process of applying electrical discharge machining to the through-hole.
9. The through-hole forming method according to claim 1 , wherein
0.17≤sin θ≤0.21.
10. The through-hole forming method according to claim 1 , wherein
0.18≤sin θ≤0.20.
11. A method of manufacturing a glass substrate provided with a through-hole, the method comprising:
a process of forming, by condensing and irradiating a laser beam from a carbon dioxide laser onto a glass substrate through a lens, a through-hole that passes through the glass substrate in a thickness direction of the glass substrate,
wherein a medium between the lens and the glass substrate is air, and
wherein a converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
( d/ 2)/ f =tan θ (1), and
0.16≤sin θ≤0.22 (2).
12. A through-hole forming method comprising:
a process of forming, by condensing and irradiating a laser beam from a carbon dioxide laser onto a glass insulation substrate through a lens, a through-hole that passes through the glass insulation substrate in a thickness direction of the glass insulation substrate,
wherein a medium between the lens and the glass insulation substrate is air, and
wherein a converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
( d/ 2)/ f =tan θ (1), and
0.16≤sin θ≤0.22 (2).
13. The through-hole forming method according to claim 12 , wherein
0.17≤sin θ≤0.21.
14. The through-hole forming method according to claim 12 , wherein
0.18≤sin θ≤0.20.