Flexible, hermetic electrical interconnect for electronic and optoelectronic devices for in vivo use

1. A method of fabricating a hermetic electric interconnect for an optoelectronic device, the method comprising the steps of:

(a) depositing a bottom metal layer on a substrate;

(b) depositing a bottom insulating layer on the bottom metal layer to insulate the bottom metal layer; and (bs) patterning the bottom insulating layer to form a bottom seal ring trench;

(c) (c 1 ) depositing an interconnect metal layer on the bottom insulating layer, (c 1 s) to fill the bottom seal ring trench to form a bottom sealing ring; and (c 2 ) patterning the interconnect metal layer to form electrical connections between contact pads, and (c 2 s) to form a middle sealing ring around the electrical connections;

(d) (d 1 ) depositing a top insulating layer on the interconnect metal layer to insulate the interconnect metal layer, and (d 1 s) to separate the middle sealing ring from the interconnect metal layer; and (d 2 ) patterning the top insulating layer to form feedthrough holes coupled with the contact pads, and (d 2 s) to form a top sealing ring trench coupled with the middle sealing ring;

(e) (e 1 ) depositing a top metal layer on the top insulating layer to start forming contacts by filling the feedthrough holes, and (e 1 s) to start forming a top sealing ring by filling the top seal ring trench; and (e 2 ) patterning the top metal layer to complete forming contacts through the feedthrough holes, to form a separate barrier layer, and (e 2 s) to complete forming the top sealing ring, coupled with the middle sealing ring; and

(f) seating contact pads of a first electronic module and a second electronic module into the contacts, and (fs) seating a module sealing ring into the top sealing ring.

2. The method of claim 1 , wherein:

at least one of the depositing of the interconnect metal layer, the bottom metal layer and the top metal layer includes sputtering.

3. The method of claim 1 , wherein:

at least one of the depositing and patterning the bottom insulating layer and the depositing and patterning the top insulating layer includes at least one of spin-coating, spray-coating and lamination.

4. The method of claim 1 , the depositing and patterning the top insulating layer comprising:

patterning the top insulating layer to have a stepped coverage pattern at a feedthrough hole to enhance a sealing efficiency.

5. The method of claim 1 , the depositing the bottom metal layer and the top metal layer comprising:

depositing a metal layer including at least one of Ti, Au, Pt, and Nb.

6. A method of fabricating a hermetic electric interconnect for an optoelectronic device, the method comprising the steps of:

(a) forming a planarized structure from a first electronic module and a second electronic module with exposed electronic contact pads;

(b) depositing a module metal layer on the planarized structure, and patterning the deposited module metal layer to have feedthrough holes, coupled with the electronic contact pads of the first and second electronic modules;

(c) depositing a first insulating layer on the module metal layer to insulate the module metal layer, and patterning the deposited first insulating layer to insulate an inner surface of the feedthrough holes;

(d) depositing an interconnect metal layer on the first insulating layer and into the feedthrough holes to form contacts, and patterning the deposited interconnect metal layer to form electrical connects between the contacts corresponding to the contact pads of the first and the second electronic modules;

(e) depositing a second insulating layer on the interconnect metal layer to seal the interconnect metal layer; and

(f) depositing a final barrier layer on the second insulating layer to complete the hermetic seal of the electric interconnect.

7. The method of claim 6 , the forming the planarized structure comprising:

(a) providing a temporary substrate;

(b) affixing the first and second electronic modules to the temporary substrate with an adhesive;

(c) covering the first and second electronic modules with an epoxy; and

(d) removing the temporary substrate.

8. The method of claim 6 , wherein:

the depositing the interconnect metal layer is performed with sputtering; and

the depositing at least one of the first insulating layer and the second insulating layer is performed with at least one of spin-coating, spray-coating and lamination.

9. The method of claim 6 , wherein:

at least one of the depositing the module metal layer and the depositing the final barrier layer includes depositing a metal layer including at least one of Ti, Au, Pt, and Nb.