The wiring board in the present invention includes: an insulating board; external connection pads for a differential signal and external connection pads for grounding or a power supply formed on a lower surface of the insulating board; and a through-conductor formed in the insulating board. Each of the external connection pads is formed in a two-dimensional arrangement, a diameter and an arrangement pitch of the external connection pad for a differential signal are smaller than a diameter and an arrangement pitch of the external connection pad for grounding or a power supply, and an arrangement pitch of the through-conductor connected to the external connection pad for a differential signal is less than or equal to an arrangement pitch of the external connection pad for a differential signal.
1. A wiring board comprising:
an insulating board;
at least a pair of mutually adjacent external connection pads for a differential signal and a plurality of external connection pads for grounding or a power supply formed on a lower surface of the insulating board; and
a through-conductor formed in the insulating board, the through-conductor electrically connected to each of the external connection pads,
wherein each of the external connection pads is formed in a two-dimensional arrangement,
wherein a diameter and an arrangement pitch of the external connection pad for a differential signal are smaller than a diameter and an arrangement pitch of the external connection pad for grounding or a power supply, and
wherein an arrangement pitch of the through-conductor connected to the external connection pad for a differential signal is less than or equal to an arrangement pitch of the external connection pad for a differential signal.
2. The wiring board according to claim 1 , wherein the insulating board is formed by an insulating plate, and at least one insulating layer laminated on each of an upper surface and a lower surface of the insulating plate.
3. The wiring board according to claim 1 , wherein a diameter of the external connection pad for a differential signal is less than a diameter of the external connection pad for grounding or a power supply by 100 to 300 μm.
4. The wiring board according to claim 1 , wherein an arrangement pitch of the external connection pad for a differential signal is less than an arrangement pitch of the external connection pad for grounding or a power supply by 0.35 to 0.8 mm.
5. The wiring board according to claim 1 , wherein a difference between an arrangement pitch of the through-conductor connected to the external connection pad for a differential signal and an arrangement pitch of the external connection pad for a differential signal is 0 to 0.25 mm.