Nonvolatile memory device and method for fabricating the same
A three-dimensional nonvolatile memory device and a method for fabricating the same include a semiconductor substrate, a plurality of active pillars, a plurality of gate electrodes, and a plurality of supporters. The semiconductor substrate includes a memory cell region and a contact region. The active pillars extend in the memory cell region perpendicularly to the semiconductor substrate. The gate electrodes intersect the active pillars, extend from the memory cell region to the contact region and are stacked on the semiconductor substrate. The supporters extend in the contact region perpendicularly to the semiconductor substrate to penetrate at least one or more of the gate electrodes.
1. A nonvolatile memory device comprising:
a substrate including a memory cell region and a contact region;
a plurality of first pillars extending in the memory cell region perpendicular to the substrate;
a plurality of electrodes that cross the first pillars, extend from the memory cell region to the contact region, and are stacked on the substrate to have a stair-step structure on the contact region;
a plurality of second pillars in the contact region extending perpendicular to the substrate, the second pillars penetrating the stair-step structure of the electrodes; and
a plurality of contact plugs on the contact region and connected to respective ones of the electrodes,
wherein each of the contact plugs is between adjacent ones of the second pillars, and
wherein uppermost surfaces of the first pillars are coplanar with uppermost surfaces of the second pillars.
2. The nonvolatile memory device of claim 1 , further comprising a data storage layer between the first pillars and the electrodes and between the second pillars and the electrodes.
3. The nonvolatile memory device of claim 1 , wherein the first pillars and the second pillars comprise semiconductor material.
4. The nonvolatile memory device of claim 1 , wherein at least one of the contact plugs is shorter than the second pillars.
5. The nonvolatile memory device of claim 1 , wherein top surfaces of the contact plugs are equidistant from a top surface of the substrate and bottom surfaces of the contact plugs are located at different distances from the top surface of the substrate.
6. The nonvolatile memory device of claim 1 , wherein the electrodes have a horizontal length that decreases with increasing vertical height from the substrate.
7. The nonvolatile memory device of claim 1 , further comprising bit lines crossing the electrodes and connected to the first pillars.
8. A nonvolatile memory device comprising:
a substrate including a memory cell region and a contact region;
a stack structure comprising a plurality of electrodes vertically stacked on the substrate, the stack structure comprising a stair-step structure extending in a first direction on the contact region;
a plurality of first pillars penetrating the stack structure in the memory cell region;
a plurality of second pillars penetrating the stair-step structure of the stack structure in the contact region; and
a plurality of contact plugs on the contact region and connected to respective ones of the electrodes,
wherein the first pillars and the second pillars have equal lengths, respectively, in a second direction perpendicular to the substrate, and
wherein the second pillars are free of connection with any conductive lines.
9. The nonvolatile memory device of claim 8 , further comprising a data storage layer between the first pillars and the electrodes and between the second pillars and the electrodes.
10. The nonvolatile memory device of claim 8 , wherein the first pillars and the second pillars comprise semiconductor material.
11. The nonvolatile memory device of claim 8 , wherein the contact plugs have a vertical length that increases with increasing distance from the memory cell region.
12. The nonvolatile memory device of claim 8 , wherein top surfaces of the contact plugs are coplanar with each other and bottom surfaces of the contact plugs are located at different distances from a top surface of the substrate.
13. The nonvolatile memory device of claim 8 , wherein the electrodes comprise sidewalls located at different horizontal positions from each other, on the contact region.
14. The nonvolatile memory device of claim 8 , further comprising bit lines extending along a third direction perpendicular to the first direction and parallel to an uppermost surface of the substrate and connected to the first pillars.
15. A memory device comprising:
a stack comprising:
first and second electrodes; and
an insulating layer between the first and second electrodes;
a plurality of vertical semiconductor structures in the stack;
a plurality of vertical support structures in the stack; and
first and second contact plugs connected to the first and second electrodes, respectively,
wherein a first of the plurality support structures penetrates the first and second electrodes, and
wherein a second of the plurality of vertical support structures penetrates the first electrode and is spaced apart from the second electrode,
wherein the second of the plurality of vertical support structure is between the first and second contact plugs, and
wherein respective uppermost surfaces of the plurality of vertical support structures are coplanar.
16. The memory device of claim 15 , wherein:
the first and second electrodes comprise respective metal electrodes; and
the plurality of vertical semiconductor structures and the plurality of vertical support structures are in a memory region and a contact region, respectively, of the memory device.