CMUT assembly with acoustic window

1. A method comprising:

forming one or more capacitive micromachined ultrasonic transducers (CMUTs) on a CMUT substrate, the one or more CMUTS formed to have an operational direction facing away from the CMUT substrate;

disposing a coupling medium over the one or more CMUTs and the CMUT substrate; and

disposing an acoustic window over the coupling medium, the one or more CMUTs, and the CMUT substrate, wherein the coupling medium couples acoustic energy between the one or more CMUTs and the acoustic window, wherein:

the forming the one or more CMUTs on the CMUT substrate comprises forming the one or more CMUTs to include a flexible membrane as an outer surface of the one or more CMUTs; and

the flexible membrane is adjacent to the coupling medium following disposing of the coupling medium over the one or more CMUTs and the CMUT substrate.

2. The method as recited in claim 1 , further comprising forming a protection layer over the one or more CMUTs, wherein the protection layer is disposed between the flexible membrane and the coupling medium to electrically insulate, at least in part, the one or more CMUTs from the coupling medium.

3. The method as recited in claim 1 , further comprising:

forming an electrode on the flexible membrane; and

forming a protection layer over the one or more CMUTs, wherein the protection layer is disposed between the electrode and the coupling medium to electrically insulate, at least in part, the one or more CMUTs from the coupling medium.

4. The method as recited in claim 1 , further comprising disposing the acoustic window over the coupling medium after disposing the coupling medium over the one or more CMUTs and the CMUT substrate.

5. The method as recited in claim 1 , further comprising disposing the acoustic window over the one or more CMUTs and the CMUT substrate before disposing the coupling medium over the one or more CMUTs and the CMUT substrate.

6. The method as recited in claim 1 , wherein the forming the CMUTs on the CMUT substrate comprises forming a plurality of CMUT elements to form an array of CMUT elements on the CMUT substrate.

7. The method as recited in claim 6 , further comprising forming the array with a curve to focus emitted acoustic energy on a focal location and/or to achieve a desired acoustic beam profile.

8. The method as recited in claim 1 , further comprising:

disposing the CMUT substrate on a packaging substrate; and

forming a seal between a housing and the packaging substrate to contain the coupling medium.

9. The method as recited in claim 1 , further comprising:

constructing the acoustic window of a first material; and

constructing the coupling medium of a second material having an acoustic property different from the first material.

10. A capacitive micromachined ultrasonic transducer (CMUT) apparatus comprising:

a CMUT substrate;

one or more CMUTs formed on the CMUT substrate to have an operational direction facing away from the CMUT substrate;

an acoustic window, the acoustic window disposed over the one or more CMUTs and the CMUT substrate to pass acoustic energy to or from the one or more CMUTs in the operational direction; and

a coupling medium disposed between the one or more CMUTs and the acoustic window to couple the acoustic energy between the one or more CMUTs and the acoustic window, wherein:

the one or more CMUTs include a flexible membrane as an outer surface of the one or more CMUTs, and

the flexible membrane is adjacent to the coupling medium.

11. The CMUT apparatus as recited in claim 10 , further comprising a protection layer disposed over the one or more CMUTs, wherein the protection layer is disposed between the flexible membrane and the coupling medium to electrically insulate, at least in part, the one or more CMUTs from the coupling medium.

12. The CMUT apparatus as recited in claim 10 , further comprising:

an electrode on the flexible membrane; and

a protection layer disposed over the one or more CMUTs, wherein the protection layer is disposed between the electrode and the coupling medium to electrically insulate, at least in part, the one or more CMUTs from the coupling medium.

13. The CMUT apparatus as recited in claim 10 , wherein:

the acoustic window is constructed of a first material; and

the coupling medium is constructed of a second material having an acoustic property different from the first material.

14. A capacitive micromachined ultrasonic transducer (CMUT) apparatus comprising:

a CMUT substrate;

a plurality of CMUT cells formed on the CMUT substrate to have an operational direction facing away from the CMUT substrate, wherein the plurality of CMUT cells are configured as an array;

an acoustic window, the acoustic window disposed over the one or more CMUTs and the CMUT substrate to pass acoustic energy to or from the one or more CMUTs in the operational direction; and

a coupling medium disposed between the one or more CMUTs and the acoustic window to couple the acoustic energy between the one or more CMUTs and the acoustic window, wherein:

the CMUT cells include respective flexible membranes as an outer surface of the CMUT cells, and

the flexible membrane is adjacent to the coupling medium.

15. The CMUT apparatus as recited in claim 14 , wherein the array includes a plurality of CMUT elements, each element including a group of the CMUT cells.

16. The CMUT apparatus as recited in claim 15 , wherein at least some of the CMUT elements share a common first electrode and have independently addressable electrodes as respective second electrodes.

17. The CMUT apparatus as recited in claim 14 , wherein:

the acoustic window is constructed of a first material; and

the coupling medium is constructed of a second material having an acoustic property different from the first material.