IP Library Granted Patent US 10,380,397
Granted Patent B2
US 10,380,397 · App. 14/978,442 · Granted Aug 13, 2019

Half-bridge fingeprint sensing method

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Quick Facts
Patent No.
US 10,380,397
App. No.
14/978,442
Granted
Aug 13, 2019
Kind
B2
Abstract

Fingerprint detection circuits with common mode noise rejection are described. The Fingerprint detection circuit includes a half-bridge circuit coupled to a receive (RX) electrode of an array of fingerprint detection electrodes and to a buried capacitance that is unalterable by the presence of a conductive object on the array. The fingerprint detection circuit may also include a listener electrode configured to enable common mode noise rejection through a differential input stage of a low noise amplifier (LNA).

Claims (28)

1. A differential capacitance measurement circuit comprising:

a half-bridge circuit comprising a first mutual capacitor and a second mutual capacitor coupled to a first input of an amplifier;

a listener electrode coupled to a second input of the amplifier; and

a compensation circuit comprising:

a modulator;

a buffer coupled to an output of the modulator, the buffer configured to output a compensation signal; and

a compensation capacitor coupled between an output of the buffer and the first input of the amplifier.

2. The differential capacitance measurement circuit of claim 1 , wherein the buffer configured to output the compensation signal oscillates between a programmable voltage and a ground potential.

3. The differential capacitance measurement circuit of claim 1 , further comprising:

a first buffer configured to provide a first transmit signal to a first node of the first mutual capacitor; and

a second buffer configured to provide a second transmit signal to a first node of the second mutual capacitor.

4. The differential capacitance measurement circuit of claim 3 , wherein the first transmit signal and the second transmit signal are 180 degrees out of phase.

5. The differential capacitance measurement circuit of claim 3 , further comprising:

a third buffer configured to provide a third transmit signal to a first node of a third mutual capacitance, wherein the third mutual capacitance is coupled to the first input of the amplifier; and

control logic for providing control signals to the second and third buffers.

6. The differential capacitance measurement circuit of claim 5 , wherein the first and third transmit signal are in-phase.

7. The differential capacitance measurement circuit of claim 1 , wherein the listener electrode is configured to couple to a conductive object and provide common mode noise rejection at the second input of the amplifier.

8. A method for measuring a capacitance comprising:

receiving a first signal derived from the capacitance on a receive node, the receive node coupled to a first input of an amplifier;

receiving a second signal derived from a buried capacitance on the receive node;

receiving a third signal on a listener electrode, the listener electrode coupled to a second input of the amplifier;

generating a differential output of the amplifier;

converting the differential output of the amplifier to a digital value representative of the capacitance; and

receiving a fourth signal on the receive node, wherein the fourth signal is configured to provide a compensation current to the input of the amplifier, and wherein the fourth signal is produced by a modulator coupled to a buffer, which is coupled to a compensation capacitor coupled to the first input of the amplifier.

9. The method of claim 8 , wherein the first signal on the receive node is generated by a first transmit signal on a first node of a capacitor and received on a second node of the capacitor coupled to the receive node.

10. The method of claim 8 , wherein the second signal on the receive node is generated by a second transmit signal on a first node of a capacitor and received on a second node of the capacitor coupled to the receive node.

11. The method of claim 10 , wherein the capacitor is formed by a drive electrode and a buried receive electrode.

12. The method of claim 8 , wherein the second signal is defined by control logic coupled to a buffer, the buffer comprising an output coupled to transmit electrode and the receive node coupled to a receive electrode.

Assignments (6)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST Recorded Dec 5, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 051209/0721 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FOLLOWING NUMBERS 6272046,7277824,7282374,7286384,7299106,7337032,7460920,7519447 PREVIOUSLY RECORDED ON REEL 039676 FRAME 0237. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Oct 16, 2018
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING
Reel/Frame 047797/0854 →
SECURITY INTEREST Recorded Aug 15, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039676/0237 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2015
From: KRAVETS, IGOR; OGIRKO, ROMAN; HOSHTANAR, OLEKSANDR; KLEIN, HANS
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 037351/0055 →