IP Library › Patent Application 14980105
Patent Application
App. No. 14/980,105

HIGH IMPACT SOLDER TOUGHNESS ALLOY

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Quick Facts
Patent No.
US None
App. No.
14/980,105
Abstract

A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.

Claims (57)

1 .- 20 . (canceled)

21 . A lead-free solder alloy, comprising:

from 35 to 59% wt Bi;

Cu in a concentration up to 1.0 wt %;

from 0.01 to 0.5 wt % Ni;

and the balance Sn, together with any unavoidable impurities.

22 . The alloy of claim 21 further comprising Ag.

23 . The alloy of claim 21 further comprising Ag in a concentration up to 1.0 wt %.

24 . The alloy of claim 21 consisting essentially of:

from 35 to 59% wt Bi;

from 0.05 to 0.5 wt % Cu;

from 0.01 to 0.05 wt % Ni;

Ag in the concentration up to 1.0 wt %;

and balance Sn, together with any unavoidable impurities.

25 . The alloy of claim 21 consisting of:

from 35 to 59% wt Bi;

from 0.05 to 0.5 wt % Cu;

from 0.01 to 0.05 wt % Ni;

Ag in the concentration up to 1.0 wt %;

and balance Sn, together with any unavoidable impurities.

26 . The alloy of claim 24 wherein the Ag is present in a concentration of at least 0.4 wt %.

27 . The alloy of claim 24 wherein the Cu is present in a concentration of at least 0.1 wt %.

28 . The alloy of claim 22 wherein the Ag is present in a concentration of at least 0.4 wt % and Cu is present in a concentration of at least 0.1 wt %.

29 . The alloy of claim 24 wherein the Ag is present in a concentration of at least 0.4 wt % and Cu is present in a concentration of at least 0.1 wt %.

30 . The alloy of claim 24 wherein the Cu is present in a concentration of at least 0.1 wt %, and the Bi is present in a concentration of 57 to 59 wt %.

31 . The alloy of claim 24 wherein the Ag is present in a concentration of at least 0.4 wt %, the Cu is present in a concentration of at least 0.1 wt %, and the Bi is present in a concentration of 57 to 59 wt %.

32 . The alloy of claim 21 consisting essentially of:

from 35 to 59% wt Bi;

Cu in a concentration up to 1.0 wt %;

from 0.01 to 0.05 wt % Ni;

Ag in a concentration up to 1.0 wt %;

and the balance Sn, together with any unavoidable impurities.

33 . The alloy of claim 21 consisting of:

from 35 to 59% wt Bi;

Cu in a concentration up to 1.0 wt %;

from 0.01 to 0.05 wt % Ni;

Ag in a concentration up to 1.0 wt %;

and the balance Sn, together with any unavoidable impurities.

34 . The alloy of claim 33 wherein the Cu is present in a concentration between 0.05 and 0.4 wt %.

35 . The alloy of claim 33 wherein the Cu is present in a concentration between 0.05 and 0.4 wt %.

36 . The alloy of claim 21 consisting essentially of:

from 35 to 59% wt Bi;

Cu in a concentration up to 1.0 wt %;

from 0.025 to 0.1 wt % Ni;

and the balance Sn, together with any unavoidable impurities.

37 . The alloy of claim 21 consisting of:

from 35 to 59% wt Bi;

Cu in a concentration up to 1.0 wt %;

from 0.025 to 0.1 wt % Ni;

and the balance Sn, together with any unavoidable impurities.

38 . The alloy of claim 40 wherein the Cu is present in a concentration from 0.05 to 0.4 wt %.

39 . The alloy of claim 40 wherein the Cu is present in a concentration from 0.1 to 0.3 wt %.

40 . The alloy of claim 21 consisting essentially of:

from 57 to 59% wt Bi;

Cu in a concentration up to 1.0 wt %;

from 0.01 to 0.1 wt % Ni;

and the balance Sn, together with any unavoidable impurities.