IP Library Granted Patent US 10,384,283
Granted Patent B2
US 10,384,283 · App. 14/983,526 · Granted Aug 20, 2019

Method for making a high temperature resistant silicon alloy joint for the joining of ceramics and devices using same

Inventors: Brent Elliot (Cupertino, CA); Alfred Grant Elliott (Palo Alto, CA)
Assignee: Component Re-Engineering Company, Inc.
B23K1/0016B23K1/19B23K35/286B23K35/302B23K35/36C04B35/581C04B37/003C04B37/006C04B2237/16C04B2237/366
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Quick Facts
Patent No.
US 10,384,283
App. No.
14/983,526
Granted
Aug 20, 2019
Kind
B2
Abstract

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a silicon and an alloying element under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck.

Claims (5)

1. A method for the joining of ceramic materials, said method comprising the steps of:

placing a brazing element in a joint interface area between the first interface surface of a first ceramic piece and the first interface area of a second ceramic piece to create a joining pre-assembly, said brazing element comprising silicon and germanium, wherein germanium comprises 2 to 70 mole percent of said brazing element, and wherein the remainder of said brazing element is silicon, wherein said first ceramic piece comprises aluminum nitride, and wherein said second ceramic piece comprises aluminum nitride;

placing the joining pre-assembly into a process chamber;

removing oxygen from said process chamber prior to the heating step, wherein the step of removing oxygen comprises applying a pressure of lower than 1×10E-4 Torr to said process chamber; and

heating said joining pre-assembly to a first joining temperature, thereby joining said first ceramic piece to said second ceramic.

Assignments (4)
PATENT SECURITY AGREEMENT (SHORT FORM) Recorded Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 054169/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2019
From: ELLIOT, ALFRED GRANT
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 049039/0291 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2019
From: ELLIOT, BRENT
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 049039/0382 →
Continuity (2)
Provisional Application 62098334 · Dec 31, 2014
Related Publication 20160184912A1 · Jun 30, 2016