Method and system for heat sinking of camera module
A method and apparatus for heat sinking a camera module, which may be used in an automotive camera, which includes but is not limited to automotive rear-view cameras, is described herein. Heating conductors and heat conductive pads may be arranged in a parallel orientation within the housing of the camera module to dissipate heat produced by the printed circuit boards (PCBs) and other components within. The heat conducting pads may conduct heat away from the PCB or component being cooled and into the heat sink, which may be a heat conducting material including but not limited to aluminum, aluminum alloys, or copper. The heating pads may also fill the air gaps within the housing of the camera module.
1. A method for heat sinking a camera module, the method comprising:
placing a first heat conductive pad in parallel along an upper side of a heat conductor and folding a portion of the first heat conductive pad over each edge of the upper side of the heat conductor;
placing a second heat conductive pad that is planar and separate from the first heat conductive pad in parallel along an underside of the heat conductor and folding a portion of the heat conductor over each edge of the upper side of the second heat conductive pad to enable a dissipation of heat produced by a plurality of printed circuit boards (PCBs) and components to be cooled; and
placing the heat conductor with the first and second heat conductive pads inside a camera module housing, wherein the heat conductor is placed in proximity to at least one PCB of the plurality of PCBs or component from the plurality of PCBs and components to be cooled;
wherein the first heat conductive pad and the heat conductor are non-planar and the folded portion of the first heat conductive pad and the folded portion of the heat conductor extend past the second heat conductive pad.
2. The method of claim 1 , wherein the camera module is associated with an automotive rear-view camera.
3. The method of claim 1 , wherein the first heat conductive pad and second heat conductive pad fill air gaps within the camera module housing.
4. The method of claim 1 , wherein the heat conductor is aluminum.
5. The method of claim 1 , wherein the heat conductor is an aluminum alloy.
6. The method of claim 1 , wherein the heat conductor is copper.
7. The method of claim 1 , wherein the heat conductor is zinc.
8. A camera module, the camera module comprising:
a first heat conductive pad placed in parallel along an upper side of a heat conductor, wherein a portion of the first heat conductive pad is folded over each edge of the upper side of the heat conductor;
a second heat conductive pad that is planar and separate from the first heat conductive pad and placed in parallel along an underside of the heat conductor, wherein a portion of the heat conductor is folded over each edge of the upper side of the second heat conductive pad, to enable a dissipation of heat produced by a plurality of printed circuit boards (PCBs) and components to be cooled; and
the heat conductor placed inside a camera module housing, wherein the heat conductor is placed in proximity to at least one PCB of the plurality of PCBs or component from the plurality of PCBs and components to be cooled;
wherein the first heat conductive pad and the heat conductor are non-planar and the folded portion of the first heat conductive pad and the folded portion of the heat conductor extend past the second heat conductive pad.
9. The camera module of claim 8 , wherein the camera module is associated with an automotive rear-view camera.
10. The camera module of claim 8 , wherein the first heat conductive pad and second heat conductive pad fill air gaps within the camera module housing.
11. The camera module of claim 8 , wherein the heat conductor is aluminum.
12. The camera module of claim 8 , wherein the heat conductor is an aluminum alloy.
13. The camera module of claim 8 , wherein the heat conductor is copper.
14. The camera module of claim 8 , wherein the heat conductor is zinc.