Radiation emitting or receiving optoelectronic semiconductor chip
View Patent ↗An optoelectronic semiconductor chip includes a multiplicity of active regions arranged at a distance from one another, and a continuous current spreading layer, wherein at least one of the active regions has a main extension direction, one of the active regions has a core region formed with a first semiconductor material, the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region, the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and the current spreading layer covers all cover layers of the active region.
1. An optoelectronic semiconductor chip comprising:
a multiplicity of active regions arranged at a distance from one another; and
a continuous current spreading layer, wherein
at least one of the active regions has a main extension direction,
one of the active regions has a core region formed with a first semiconductor material,
the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region,
the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and
the current spreading layer covers said cover layer of the active region in directions transversely and parallel with respect to the main extension direction of the active region.
2. The optoelectronic semiconductor chip according to claim 1 , further comprising a reflective layer arranged at an underside of the multiplicity of active regions, said reflective layer reflecting electromagnetic radiation generated during operation in the active layer.
3. The optoelectronic semiconductor chip according to claim 1 , wherein the active regions are based on a nitride compound semiconductor material.
4. The optoelectronic semiconductor chip according to claim 1 ,
wherein the first semiconductor material is deposited epitaxially onto a growth substrate,
a growth direction of the first semiconductor material is substantially parallel to the main extension direction, and
the optoelectronic semiconductor chip is free of the growth substrate.
5. The optoelectronic semiconductor chip according to claim 1 , wherein the active region has a length determined in the main extension direction, and has a diameter determined in a plane perpendicular to the main extension direction, and a ratio of length to diameter is at least three.
6. The optoelectronic semiconductor chip according to claim 1 , wherein the current spreading layer is transmissive to electromagnetic radiation generated during operation in the active layer.
7. The optoelectronic semiconductor chip according to claim 1 , wherein the current spreading layer is formed with a transparent conductive oxide.
8. The optoelectronic semiconductor chip according to claim 1 , wherein the active region has a length determined in the main extension direction and the current spreading layer extends over at least a large portion of the length of the active region.
9. The optoelectronic semiconductor chip according to claim 1 , further comprising an insulation material arranged between the multiplicity of active regions, the insulation material being transmissive to electromagnetic radiation generated during operation in the active layer, and
the insulation material surround the active regions at least in directions transversely with respect to the main extension direction.
10. The optoelectronic semiconductor chip according to claim 9 , wherein the insulation material directly adjoins an outer surface of the active region at least in places.
11. The optoelectronic semiconductor chip according to claim 9 , wherein the insulation material directly adjoins the current spreading layer at least in places.
12. The optoelectronic semiconductor chip according to claim 9 , further comprising a reflective layer arranged at an underside of the multiplicity of active regions, said reflective layer reflecting electromagnetic radiation generated during operation in the active layer, and the reflective layer directly adjoins the insulation material in places.
13. The optoelectronic semiconductor chip according to claim 1 , further comprising a mask layer arranged at a coupling-out side of the multiplicity of active regions, wherein the mask layer has, for each of the active regions, an opening through which the first semiconductor material penetrates.
14. The optoelectronic semiconductor chip according to claim 13 , wherein the mask layer is transmissive to electromagnetic radiation generated during operation in the active layer.
15. The optoelectronic semiconductor chip according to claim 2 , further comprising a coupling-out layer arranged at that side of the multiplicity of active regions facing away from the reflective layer, said coupling-out layer being formed with the first semiconductor material.
16. The optoelectronic semiconductor chip according to claim 13 , further comprising a coupling-out layer arranged at the coupling-out side of the active regions, said coupling-out layer being formed with the first semiconductor material, wherein the first semiconductor material of the coupling-out layer connects to the first semiconductor material in the core regions of the active regions through the openings in the mask layer.
17. The optoelectronic semiconductor chip according to claim 2 , wherein the active region has a passivation layer at its underside facing the reflective layer, said passivation layer directly adjoining the reflective layer and the core region of the active region.
18. An optoelectronic semiconductor chip comprising:
a multiplicity of active regions arranged at a distance from one another, wherein
at least one of the active regions has a main extension direction,
one of the active regions has a core region formed with a first semiconductor material,
the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region,
the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and
an insulation material is arranged between the multiplicity of active regions, the insulation material surrounding the active regions at least in directions transversely with respect to the main extension direction.
19. An optoelectronic semiconductor chip comprising:
a multiplicity of active regions arranged at a distance from one another, wherein
at least one of the active regions has a main extension direction,
one of the active regions has a core region formed with a first semiconductor material,
the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region,
the active region has a cover layer foinied with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and
the active region has a length determined in the main extension direction, has a diameter determined in a plane being perpendicular to the main extension direction, and ratio of length to diameter is at least three.