Laser process and corresponding structures for fabrication of solar cells with shunt prevention dielectric
View Patent ↗Contact holes of solar cells are formed by laser ablation to accommodate various solar cell designs. Use of a laser to form the contact holes is facilitated by replacing films formed on the diffusion regions with a film that has substantially uniform thickness. Contact holes may be formed to deep diffusion regions to increase the laser ablation process margins. The laser configuration may be tailored to form contact holes through dielectric films of varying thicknesses.
1. A solar cell comprising:
a P-type diffusion region and a plurality of N-type diffusion regions, wherein the P-type diffusion region touches at least one of the N-type diffusion regions;
a P-type metal contact that is electrically coupled to the P-type diffusion region;
an N-type metal contact that is electrically coupled to the N-type diffusion regions and is directly over the P-type diffusion region;
a first dielectric layer over the P-type diffusion region and the N-type diffusion regions, the first dielectric layer comprising contact holes that expose the N-type diffusion regions but not the P-type diffusion region, the first dielectric layer being configured to electrically isolate the P-type diffusion region from the N-type metal contact, the N-type metal contact being electrically coupled to the N-type diffusion regions through the contact holes; and
a second dielectric layer between the N-type metal contact and the first dielectric layer, the second dielectric layer being disposed between two adjacent contact holes of the first dielectric layer.
2. The solar cell of claim 1 , wherein the second dielectric layer comprises pigmented ink.
3. The solar cell of claim 1 , wherein the second dielectric layer comprises polyimide.
4. The solar cell of claim 1 , wherein the second dielectric layer has a thickness greater than 500 Angstroms.
5. The solar cell of claim 1 , wherein the first and second dielectric layers are configured to have a breakdown voltage greater than 1×10 7 V/cm.
6. The solar cell of claim 1 , wherein the solar cell is a backside contact solar cell.
7. A solar cell comprising:
a plurality of diffusion regions of a first conductivity type and a diffusion region of a second conductivity type on a backside of a solar cell, wherein the diffusion region of the second conductivity type touches at least one of the plurality of diffusion regions of the first conductivity type;
a first metal contact that is electrically coupled to the diffusion regions of the first conductivity type and is directly over the diffusion region of the second conductivity type;
a second metal contact that is electrically coupled to the diffusion region of the second conductivity type;
an interlayer dielectric over the diffusion regions of the first conductivity type and the diffusion region of the second conductivity type, the interlayer dielectric layer comprising contact holes through which the first metal contact electrically couples to the diffusion regions of the first conductivity type, the interlayer dielectric being configured to electrically isolate the diffusion region of the second conductivity type from the first metal contact; and
a sacrificial layer between the interlayer dielectric and the first metal contact, the sacrificial layer being disposed between two adjacent contact holes of the interlayer dielectric.
8. The solar cell of claim 7 , wherein the sacrificial layer comprises pigmented ink.
9. The solar cell of claim 7 , wherein the sacrificial layer comprises polyimide.
10. The solar cell of claim 7 , wherein the sacrificial layer has a thickness greater than 500 Angstroms.
11. The solar cell of claim 7 , wherein the interlayer dielectric and the sacrificial layer have a breakdown voltage greater than 1×10 7 V/cm.
12. The solar cell of claim 7 , wherein the solar cell is a backside contact solar cell.