Bipolar mobile electrostatic carriers for wafer processing

1. A bipolar mobile electrostatic carrier for wafer processing, comprising:

a top crystalline semiconductor layer having isolated positive electrode regions and isolated negative electrode regions;

a frontside trench through said top crystalline semiconductor layer extending at least to an underlying insulating layer, said frontside trench separating said negative electrode regions and said positive electrode regions;

said insulating layer positioned between said top crystalline semiconductor layer and a bottom crystalline semiconductor layer;

a dielectric layer covering exposed surface areas of said top crystalline semiconductor layer and surface areas of said insulating layer exposed by said frontside trench;

said bottom crystalline semiconductor layer having a backside trench through said bottom crystalline semiconductor layer extending at least to said insulating layer, said backside trench forming isolated backside regions on the bottom surface of said bottom crystalline semiconductor layer aligned to said negative electrode regions and said positive electrode regions on said top crystalline semiconductor layer; and

backside contacts on said isolated backside regions, said backside contacts coupled to said positive electrode regions and said negative electrode regions, said backside contacts for charging said positive electrode regions and said negative electrode regions.

2. The bipolar mobile electrostatic carrier of claim 1 , wherein said insulating layer is a silicon dioxide layer.

3. The bipolar mobile electrostatic carrier of claim 1 , wherein said insulating layer is a thermally grown silicon dioxide layer.

4. The bipolar mobile electrostatic carrier of claim 1 , wherein said dielectric layer is a dielectric stack layer comprising a silicon dioxide layer and a silicon nitride layer.

5. The bipolar mobile electrostatic carrier of claim 1 , wherein said dielectric layer is a dielectric stack layer comprising a thermally grown silicon dioxide layer and a low-pressure chemical-vapor-deposited (LPCVD) silicon nitride layer.

6. The bipolar mobile electrostatic carrier of claim 1 , wherein said top crystalline semiconductor layer and said bottom crystalline semiconductor layer are crystalline silicon layers.

7. The bipolar mobile electrostatic carrier of claim 6 , wherein said top crystalline semiconductor layer and said bottom crystalline semiconductor layer are mono-crystalline or polycrystalline silicon layers or silicon layers.

8. The bipolar mobile electrostatic carrier of claim 1 , wherein said frontside trench is formed in a hub and spoke design.

9. The bipolar mobile electrostatic carrier of claim 1 , wherein said frontside trench forms dual pairs of isolated positive electrode regions and isolated negative electrode regions.

10. The bipolar mobile electrostatic carrier of claim 1 , wherein said bipolar mobile electrostatic carrier is arranged on a tray for batch wafer processing.

11. The bipolar mobile electrostatic carrier of claim 1 , wherein said bipolar mobile electrostatic carrier is for thin wafer processing, said thin wafer having a thickness in the range of 1 μm to 100 μm.

12. A method for fabricating a bipolar mobile electrostatic carrier for wafer processing, comprising the steps of:

forming a frontside trench in the top surface of a semiconductor substrate extending at least to a buried insulating layer, said frontside trench forming isolated frontside regions in said top surface of said semiconductor substrate;

depositing a dielectric layer on all exposed surfaces of said semiconductor substrate and surface areas of said insulating layer exposed by said frontside trench;

forming a backside trench in the bottom surface of said semiconductor substrate extending at least to said buried insulating layer, said backside trench forming isolated backside regions on said bottom surface of said semiconductor substrate aligned to said isolated regions on said top surface of said substrate; and

forming backside contact holes in said isolated backside regions on said bottom surface to said isolated frontside regions, said backside contact holes aligned to said isolated frontside regions to form backside contacts coupled to said isolated regions on said top surface of said semiconductor substrate.

13. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , wherein said semiconductor substrate is a silicon-on-insulator semiconductor substrate.

14. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , wherein said semiconductor substrate comprises a top semiconductor substrate bonded to a bottom semiconductor substrate and an insulating layer positioned between said top semiconductor substrate and said bottom semiconductor substrate.

15. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , further comprising the steps for forming said semiconductor substrate, the steps comprising:

forming an insulating layer on a first semiconductor wafer; and

bonding said first semiconductor wafer to a second semiconductor wafer.

16. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , wherein said frontside trench, said backside trench, and said backside contact holes are formed according to a deep reactive ion etch process.

17. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , wherein said frontside trench, said backside trench, and said backside contact holes are formed according to a laser drilling process.

18. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , wherein said frontside trench, said backside trench, and said backside contact holes are formed according to an anisotropic etch process.

19. The method for fabricating the bipolar mobile electrostatic carrier of claim 12 , wherein said frontside trench forms dual pairs of isolated positive electrode regions and isolated negative electrode regions.

20. A bipolar mobile electrostatic carrier for semiconductor wafer support and/or processing, comprising:

a top electrically conductive semiconductor layer having isolated positive electrode regions and isolated negative electrode regions;

a frontside trench through said top electrically conductive semiconductor layer extended to at least one underlying insulating layer, said frontside trench separating said negative electrode regions and said positive electrode regions;

said insulating layer positioned between said top electrically conductive semiconductor layer and a bottom electrically conductive semiconductor layer;

a dielectric layer covering exposed surface areas of said top electrically conductive semiconductor layer and surface areas of said insulating layer exposed by said frontside trench;

said bottom electrically conductive semiconductor layer having a backside trench through said bottom electrically conductive semiconductor layer extended to at least said insulating layer, said backside trench forming isolated backside regions on the bottom surface of said bottom electrically conductive semiconductor layer aligned to said negative electrode regions and said positive electrode regions on said top electrically conductive semiconductor layer; and

backside contacts on said isolated backside regions, said backside contacts coupled to said positive electrode regions and said negative electrode regions, said backside contacts for electrically charging said positive electrode regions and said negative electrode regions.