0204 shifted vias with merge pads
A printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is disclosed. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array provides component landing pads sized to accommodate an 0204 surface mount component within a 1.2 mm by 1.0 mm rectangular spacing. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is particularly useful for overcoming the problem of component placement on tight-pitch arrays known in the art.
1. A printed circuit board (PCB) comprising:
a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a tight-pitch grid pattern;
a set of four of vias, on an opposite side of the PCB from the BGA, spaced in a rectangular arrangement of dimensions 1.2 mm by 1.0 mm that is different from the tight-pitch grid pattern;
two diagonally opposite of said set of four vias having respective component landing pads;
a solder mask covering the component landing pads with respective openings for each of the set of four vias;
a solder pad within each said opening electrically connected respectively to each said component landing pad; and
a two-lead component attached to each solder pad.
2. The PCB of claim 1 , wherein said component landing pads accommodate an 0204 nominally dimensioned component.
3. The PCB of claim 2 , wherein said component landing pads comprise respective component landing pads of substantially rectangular shape.
4. The PCB of claim 3 , wherein said component landing pads further comprise a supplemental conductive area.
5. The PCB of claim 1 , wherein at least one of said component landing pads has an edge angled at about 70° to a side of the rectangular arrangement defined by the set of four vias.
6. The PCB of claim 1 , wherein said component landing pads accommodate a plurality of 0201 nominally dimensioned components.